Atomistic Simulations of Plasma-surface Interactions PDF Download
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Author: Maria Eve Barone
Publisher:
ISBN:
Category :
Languages : en
Pages : 350
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Book Description
Author: Maria Eve Barone
Publisher:
ISBN:
Category :
Languages : en
Pages : 350
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Book Description
Author: Joseph James Végh
Publisher:
ISBN:
Category :
Languages : en
Pages : 540
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Book Description
Author: Xin Tu
Publisher: Springer Nature
ISBN: 3030051897
Category : Science
Languages : en
Pages : 354
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Book Description
This book provides a comprehensive overview of the field of plasma catalysis, regarded as a promising alternative to thermal processes for energy and environmental applications. It bridges the gap between the plasma and catalysis research communities, covering both the fundamentals of plasma catalysis and its application in environmental and energy research. The first section of the book offers a broad introduction to plasma catalysis, covering plasma-catalyst systems, interactions, and modeling. The core of the book then focuses on different applications, describing a wide range of plasma-catalytic processes in catalyst synthesis, environmental clean-up, greenhouse gas conversion and synthesis of materials for energy applications. Chapters cover topics ranging from removal of NOx and VOCs to conversion of methane, carbon dioxide and the reforming of ethanol and methanol. Written by a group of world-leading researchers active in the field, the book forms a valuable resource for scientists, engineers and students with different research backgrounds including plasma physics, plasma chemistry, catalysis, energy, environmental engineering, electrical engineering and material engineering.
Author: David W. Humbird
Publisher:
ISBN:
Category :
Languages : en
Pages : 524
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Book Description
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566771832
Category : Technology & Engineering
Languages : en
Pages : 388
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Author: James Wei
Publisher: Elsevier
ISBN: 0080488269
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
In recent years chemical engineers have become increasingly involved in the design and synthesis of new materials and products as well as the development of biological processes and biomaterials. Such applications often demand that product properties be controlled with precision. Molecular modeling, simulating chemical and molecular structures or processes by computer, aids scientists in this endeavor. Volume 28 of Advances in Chemical Engineering presents discussions of theoretical and computational methods as well as their applications to specific technologies.
Author: Dirk Naujoks
Publisher: Springer Science & Business Media
ISBN: 3540321497
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
This book deals with the specific contact between the fourth state of matter, i.e. plasma, and the first state of matter, i.e. a solid wall, in controlled fusion experiments. A comprehensive analysis of the main processes of plasma-surface interaction is given together with an assessment of the most critical questions within the context of general criteria and operation limits. It also contains a survey on other important aspects in nuclear fusion.
Author: Bryan Andrew Helmer
Publisher:
ISBN:
Category :
Languages : en
Pages : 554
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Book Description
Author: Thorsten Lill
Publisher: John Wiley & Sons
ISBN: 3527824200
Category : Technology & Engineering
Languages : en
Pages : 306
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Book Description
Learn about fundamental and advanced topics in etching with this practical guide Atomic Layer Processing: Semiconductor Dry Etching Technology delivers a hands-on, one-stop resource for understanding etching technologies and their applications. The distinguished scientist, executive, and author offers readers in-depth information on the various etching technologies used in the semiconductor industry, including thermal, isotropic atomic layer, radical, ion-assisted, and reactive ion etching. The book begins with a brief history of etching technology and the role it has played in the information technology revolution, along with a collection of commonly used terminology in the industry. It then moves on to discuss a variety of different etching techniques, before concluding with discussions of the fundamentals of etching reactor design and newly emerging topics in the field such as the role played by artificial intelligence in the technology. Atomic Layer Processing includes a wide variety of other topics as well, all of which contribute to the author's goal of providing the reader with an atomic-level understanding of dry etching technology sufficient to develop specific solutions for existing and emerging semiconductor technologies. Readers will benefit from: A complete discussion of the fundamentals of how to remove atoms from various surfaces An examination of emerging etching technologies, including laser and electron beam assisted etching A treatment of process control in etching technology and the role played by artificial intelligence Analyses of a wide variety of etching methods, including thermal or vapor etching, isotropic atomic layer etching, radical etching, directional atomic layer etching, and more Perfect for materials scientists, semiconductor physicists, and surface chemists, Atomic Layer Processing will also earn a place in the libraries of engineering scientists in industry and academia, as well as anyone involved with the manufacture of semiconductor technology. The author's close involvement with corporate research & development and academic research allows the book to offer a uniquely multifaceted approach to the subject.
Author: Dino A. Jaroszynski
Publisher: CRC Press
ISBN: 1584887796
Category : Science
Languages : en
Pages : 454
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Book Description
A Solid Compendium of Advanced Diagnostic and Simulation ToolsExploring the most exciting and topical areas in this field, Laser-Plasma Interactions focuses on the interaction of intense laser radiation with plasma. After discussing the basic theory of the interaction of intense electromagnetic radiation fields with matter, the book covers three ap
