Advanced Electronic Packaging Materials: Volume 167 PDF Download
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Author: Andrew T. Barfknecht
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Andrew T. Barfknecht
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Alan Buckley
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 420
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 464
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Book Description
Author: Edwin D. Lillie
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
ISBN: 0471466093
Category : Technology & Engineering
Languages : en
Pages : 852
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Book Description
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author: Carlo G. Pantano
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
The symposium, held in Boston, November 1989, focuses on tailoring of an interface to optimize the adhesion or transfer of load between reinforcing phases and the matrix, to enhance crack deflection through debonding, or to control interface reactivity. Some of the papers also address the micromechanics, chemistry, and characterization of interfaces in general. Acidic paper. Annotation copyrighted by Book News, Inc., Portland, OR
Author:
Publisher:
ISBN:
Category : Laser materials
Languages : en
Pages : 548
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Book Description
Author: Shakeel Ahmed
Publisher: John Wiley & Sons
ISBN: 1119528488
Category : Science
Languages : en
Pages : 405
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Book Description
Sustainable development is a very prevalent concept of modern society. This concept has appeared as a critical force in combining a special focus on development and growth by maintaining a balance of using human resources and the ecosystem in which we are living. The development of new and advanced materials is one of the powerful examples in establishing this concept. Green and sustainable advanced materials are the newly synthesized material or existing modified material having superior and special properties. These fulfil today’s growing demand for equipment, machines and devices with better quality for an extensive range of applications in various sectors such as paper, biomedical, textile, and much more. Volume 2, provides chapters on the valorization of green and sustainable advanced materials from a biomedical perspective as well as the applications in textile technology, optoelectronics, energy materials systems, and the food and agriculture industry.
Author: Avishay Katz
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 672
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
