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Author: Alexander M. Korsunsky
Publisher: Butterworth-Heinemann
ISBN: 0128109912
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
Residual stresses are an important subject in materials science and engineering that has implications across disciplines, from quantum dots to human teeth, from aeroengines to automotive surface finishing. Although a number of monographs exist, no resource is available in the form of a book to serve as a good basis for teaching the fundamentals. A Teaching Essay on Residual Stresses and Eigenstrains introduces eigenstrain methods as a powerful unified approach to residual stress modeling, measurement, and management. Starting with simple residual stress states, the key relationships are elucidated between deformation processes, inelastic strains (eigenstrains) these may introduce, and the resulting residual stress states. This book is written not only for the materials scientist, mechanical engineer, and student seeking to appreciate the origins of residual stress, but also for the more mature researcher and industrial engineer looking to improve their understanding of the eigenstrain approach to describing residual stress. Provides a unified basis for understanding the fundamentals of residual stress origins and consequences Introduces a classification of the most important residual stress states and their efficient description, as well as discussing measurement approaches, their limitations, and uses Approaches the nature and application of eigenstrain methods in a systematic way to describe residual stress fields
Author: Alexander M. Korsunsky
Publisher: Butterworth-Heinemann
ISBN: 0128109912
Category : Technology & Engineering
Languages : en
Pages : 214
Get Book Here
Book Description
Residual stresses are an important subject in materials science and engineering that has implications across disciplines, from quantum dots to human teeth, from aeroengines to automotive surface finishing. Although a number of monographs exist, no resource is available in the form of a book to serve as a good basis for teaching the fundamentals. A Teaching Essay on Residual Stresses and Eigenstrains introduces eigenstrain methods as a powerful unified approach to residual stress modeling, measurement, and management. Starting with simple residual stress states, the key relationships are elucidated between deformation processes, inelastic strains (eigenstrains) these may introduce, and the resulting residual stress states. This book is written not only for the materials scientist, mechanical engineer, and student seeking to appreciate the origins of residual stress, but also for the more mature researcher and industrial engineer looking to improve their understanding of the eigenstrain approach to describing residual stress. Provides a unified basis for understanding the fundamentals of residual stress origins and consequences Introduces a classification of the most important residual stress states and their efficient description, as well as discussing measurement approaches, their limitations, and uses Approaches the nature and application of eigenstrain methods in a systematic way to describe residual stress fields
Author: Sam Zhang
Publisher: CRC Press
ISBN: 100040840X
Category : Technology & Engineering
Languages : en
Pages : 337
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Book Description
Functional Thin Films Technology features the functional aspects of thin films, such as their application in solar selective absorbers, fiber lasers, solid oxide fuel cells, piezo-related areas, catalysts, superhydrophobicity, semiconductors, and trace pesticides detection. It highlights developments and advances in the preparation, characterization, and applications of functional micro-/nano-scaled films and coatings. This book Presents technologies aimed at functionality used in nanoelectronics, solar selective absorbers, solid oxide fuel cells, piezo-applications, and sensors Covers absorbers, catalysts, anodic aluminum oxide, superhydrophobics, and semiconductor devices Features a chapter on transport phenomena associated to structures Discusses transport phenomena and material informatics This second volume in the two-volume set, Protective Thin Coatings and Functional Thin Films Technology, will benefit industry professionals and researchers working in areas related to semiconductors, optoelectronics, plasma technology, solid-state energy storages, and 5G, as well as advanced students studying electrical, mechanical, chemical, and materials engineering.
Author: Gary S.
Publisher: Springer Nature
ISBN: 3031797132
Category : Technology & Engineering
Languages : en
Pages : 172
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Book Description
This book describes the theory and practice of the Hole-Drilling Method for measuring residual stresses in engineering components. Such measurements are important because residual stresses have a "hidden" character because they exist locked-in within a material, independent of any external load. These stresses are typically created during component manufacture, for example, during welding, casting, or forming. Because of their hidden nature, residual stresses are difficult to measure and consequently are often ignored. However, they directly add to loading stresses and can cause catastrophic failure if not properly included during engineering design. Thus, there is an urgent need to be able to identify and measure residual stresses conveniently and reliably. The Hole-Drilling Method provides an adaptable and well-proven method for measuring residual stresses in a wide range of materials and component types. It is convenient to use and gives reliable results. Because of the hidden nature of residual stresses, the measurement method must necessarily be indirect, thus, additional care and conceptual understanding are necessary to achieve successful results. This book provides a practical introduction to the Hole-Drilling Method, starting from its historical roots and going on to focus on its modern practice. The various chapters describe the nature of residual stresses, the principle of hole-drilling measurements, procedures and guidance on how to make successful measurements, and effective mathematical procedures for stress computation and analysis. The book is intended for practitioners who need to make residual stress measurements either occasionally or routinely, for practicing engineers, for researchers, and for graduate engineering and science students.
Author: Holm Altenbach
Publisher: Springer Nature
ISBN: 3031261860
Category : Science
Languages : en
Pages : 781
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Book Description
In this book, well-known scientists discuss modern aspects of generalized continua, in order to better understand modern materials and advanced structures. They possess complicated internal structure, and it requires the development of new approaches to model such structures and new effects caused by it. This book combines fundamental contributions in honor of Victor Eremeyev and his 60th birthday.
Author: Emmanuel E. Gdoutos
Publisher: Springer
ISBN: 331991989X
Category : Science
Languages : en
Pages : 418
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Book Description
ICTAEM_1 treated all aspects of theoretical, applied and experimental mechanics including biomechanics, composite materials, computational mechanics, constitutive modeling of materials, dynamics, elasticity, experimental mechanics, fracture, mechanical properties of materials, micromechanics, nanomechanics, plasticity, stress analysis, structures, wave propagation. During the conference special symposia covering major areas of research activity organized by members of the Scientific Advisory Board took place. ICTAEM_1 brought together the most outstanding world leaders and gave attendees the opportunity to get acquainted with the latest developments in the area of mechanics. ICTAEM_1 is a forum of university, industry and government interaction and serves in the exchange of ideas in an area of utmost scientific and technological importance.
Author: Sujeet Kumar Sinha
Publisher: Springer Nature
ISBN: 9819992648
Category :
Languages : en
Pages : 264
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Book Description
Author: Paolo Scardi
Publisher: Trans Tech Publications Ltd
ISBN: 3038134635
Category : Technology & Engineering
Languages : en
Pages : 542
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Book Description
Selected, peer reviewed papers from the 8th European Conference on Residual Stresses, ECRS8, Riva del Garda, Italy 26-28 June 2010
Author: Michael R. Hill
Publisher:
ISBN:
Category :
Languages : en
Pages : 478
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Book Description
Author: Haruo Fujiwara
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: D.A. Hills
Publisher: Springer Science & Business Media
ISBN: 9401586489
Category : Science
Languages : en
Pages : 314
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Book Description
This book is concerned with the numerical solution of crack problems. The techniques to be developed are particularly appropriate when cracks are relatively short, and are growing in the neighbourhood of some stress raising feature, causing a relatively steep stress gradient. It is therefore practicable to represent the geometry in an idealised way, so that a precise solution may be obtained. This contrasts with, say, the finite element method in which the geometry is modelled exactly, but the subsequent solution is approximate, and computationally more taxing. The family of techniques presented in this book, based loosely on the pioneering work of Eshelby in the late 1950's, and developed by Erdogan, Keer, Mura and many others cited in the text, present an attractive alternative. The basic idea is to use the superposition of the stress field present in the unfiawed body, together with an unknown distribution of 'strain nuclei' (in this book, the strain nucleus employed is the dislocation), chosen so that the crack faces become traction-free. The solution used for the stress field for the nucleus is chosen so that other boundary conditions are satisfied. The technique is therefore efficient, and may be used to model the evolution of a developing crack in two or three dimensions. Solution techniques are described in some detail, and the book should be readily accessible to most engineers, whilst preserving the rigour demanded by the researcher who wishes to develop the method itself.
