A Chemical Vapor Deposition System for the Growth of Silicon Carbide PDF Download
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Author: Abebe Mesfin
Publisher:
ISBN:
Category :
Languages : en
Pages : 84
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Book Description
Author: Abebe Mesfin
Publisher:
ISBN:
Category :
Languages : en
Pages : 84
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Book Description
Author: Gladys Felton
Publisher:
ISBN:
Category :
Languages : en
Pages : 216
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Author: Ying Gao
Publisher:
ISBN:
Category :
Languages : en
Pages : 242
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Author: Mark A. Fanton
Publisher:
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Category :
Languages : en
Pages :
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Author: Brandy Kay Burkland
Publisher:
ISBN:
Category :
Languages : en
Pages : 166
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Book Description
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 1437744885
Category : Technology & Engineering
Languages : en
Pages : 459
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Book Description
Handbook of Chemical Vapor Deposition: Principles, Technology and Applications provides information pertinent to the fundamental aspects of chemical vapor deposition. This book discusses the applications of chemical vapor deposition, which is a relatively flexible technology that can accommodate many variations. Organized into 12 chapters, this book begins with an overview of the theoretical examination of the chemical vapor deposition process. This text then describes the major chemical reactions and reviews the chemical vapor deposition systems and equipment used in research and production. Other chapters consider the materials deposited by chemical vapor deposition. This book discusses as well the potential applications of chemical vapor deposition in semiconductors and electronics. The final chapter deals with ion implantation as a major process in the fabrication of semiconductors. This book is a valuable resource for scientists, engineers, and students. Production and marketing managers and suppliers of equipment, materials, and services will also find this book useful.
Author: Tsunenobu Kimoto
Publisher: John Wiley & Sons
ISBN: 1118313550
Category : Technology & Engineering
Languages : en
Pages : 565
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Book Description
A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applications Based on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power systems. In this wide-ranging book, the authors draw on their considerable experience to present both an introduction to SiC materials, devices, and applications and an in-depth reference for scientists and engineers working in this fast-moving field. Fundamentals of Silicon Carbide Technology covers basic properties of SiC materials, processing technology, theory and analysis of practical devices, and an overview of the most important systems applications. Specifically included are: A complete discussion of SiC material properties, bulk crystal growth, epitaxial growth, device fabrication technology, and characterization techniques. Device physics and operating equations for Schottky diodes, pin diodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, and thyristors. A survey of power electronics applications, including switch-mode power supplies, motor drives, power converters for electric vehicles, and converters for renewable energy sources. Coverage of special applications, including microwave devices, high-temperature electronics, and rugged sensors. Fully illustrated throughout, the text is written by recognized experts with over 45 years of combined experience in SiC research and development. This book is intended for graduate students and researchers in crystal growth, material science, and semiconductor device technology. The book is also useful for design engineers, application engineers, and product managers in areas such as power supplies, converter and inverter design, electric vehicle technology, high-temperature electronics, sensors, and smart grid technology.
Author: Hai-pyng Peter Liaw
Publisher:
ISBN:
Category : Epitaxy
Languages : en
Pages : 462
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Author: Payam Shoghi
Publisher:
ISBN:
Category :
Languages : en
Pages : 154
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Book Description
Crystalline layers of SiC were grown on A1N substrate using chemical vapor deposition (CVD) from a single gas source; Trimethylsilane as well as a combination of ethylene (C[subscript]2H[subscript]4), silane (SiH[subscript]4), and hydrogen (H[subscript]2) gas. The growth was conducted at temperatures ranging from 1100 to 1350[degrees]C and pressures ranging from 0.09 torr to l.86 torr. The study was conducted on AlN grown on sapphire as well as on polycrystalline AlN substrates. The CVD growth system, which was made by OSEMI, was designed to operate in wide range of pressures (10[superscript]-8 to atmospheric) and temperatures (room temperature to -2000[degrees]C) using RF heating. The system is integrated with a molecular beam epitaxy (MBE) unit to enable direct transfer of A1N layers, grown by MBE, into the CVD system. X-ray measurements, carried out using PANalytical X'Pert X-ray diffraction system demonstrated growth of single crystalline SiC while surface morphology was examined using Scanning Electron Microscopy (SEM) and Atomic Force Microscope (AFM), qualitative measure of the layers' stoichiometry was carried out using Energy Dispersive X-ray examination using conventional EDAX. The formation of single crystalline 3C-SiC was confirmed by X-ray diffraction. Atomic force microscopy (AFM) showed an increase in the roughness of the morphology for thick cubic SiC on A1N on Sapphire substrate. SEM and EDAX measurements showed the thickness of the SiC thin film and the ratio of Si and C atoms in the film.
Author: Muthu Wijesundara
Publisher: Springer Science & Business Media
ISBN: 1441971211
Category : Technology & Engineering
Languages : en
Pages : 247
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Book Description
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.
