ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis PDF Download
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Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Get Book Here
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: C.-H. Chen
Publisher: IOS Press
ISBN: 1643684590
Category : Computers
Languages : en
Pages : 1266
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Book Description
Applied mathematics, modelling, and computer simulation are central to many aspects of engineering and computer science, and continue to be of intrinsic importance to the development of modern technologies. This book presents the proceedings of AMMCS 2023, the 3rd International Conference on Applied Mathematics, Modeling and Computer Simulation, held on 12 and 13 August 2023 in Wuhan, China. The conference provided an ideal opportunity for scholars and researchers to communicate important recent developments in their areas of specialization to their colleagues, and to scientists in related disciplines. More than 250 submissions were received for the conference, of which 133 were selected for presentation at the conference and inclusion here after a thorough peer-review process. These range from the theoretical and conceptual to strongly pragmatic papers addressing industrial best practice, and cover topics such as mathematical modeling and application; engineering applications and scientific computations; and the simulation of intelligent systems. The book explores practical experiences and enlightening ideas, and will be of interest to researchers, practitioners, and to all those working in the fields of applied mathematics, modeling and computer simulation.
Author: Lejla Batina
Publisher: Springer Nature
ISBN: 3030987957
Category : Computers
Languages : en
Pages : 365
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Book Description
AI has become an emerging technology to assess security and privacy, with many challenges and potential solutions at the algorithm, architecture, and implementation levels. So far, research on AI and security has looked at subproblems in isolation but future solutions will require sharing of experience and best practice in these domains. The editors of this State-of-the-Art Survey invited a cross-disciplinary team of researchers to a Lorentz workshop in 2019 to improve collaboration in these areas. Some contributions were initiated at the event, others were developed since through further invitations, editing, and cross-reviewing. This contributed book contains 14 invited chapters that address side-channel attacks and fault injection, cryptographic primitives, adversarial machine learning, and intrusion detection. The chapters were evaluated based on their significance, technical quality, and relevance to the topics of security and AI, and each submission was reviewed in single-blind mode and revised.
Author: Navid Asadizanjani
Publisher: Elsevier
ISBN: 0443185433
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
Author: Ambika Prasad Shah
Publisher: Springer Nature
ISBN: 3031215141
Category : Computers
Languages : en
Pages : 607
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Book Description
This book constitutes the proceedings of the 26th International Symposium on VLSI Design and Test, VDAT 2022, which took place in Jammu, India, in July 2022. The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory; System Design.
Author: Mark Tehranipoor
Publisher: Springer Nature
ISBN: 3031310349
Category : Technology & Engineering
Languages : en
Pages : 331
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Book Description
This is the first book dedicated to hands-on hardware security training. It includes a number of modules to demonstrate attacks on hardware devices and to assess the efficacy of the countermeasure techniques. This book aims to provide a holistic hands-on training to upper-level undergraduate engineering students, graduate students, security researchers, practitioners, and industry professionals, including design engineers, security engineers, system architects, and chief security officers. All the hands-on experiments presented in this book can be implemented on readily available Field Programmable Gate Array (FPGA) development boards, making it easy for academic and industry professionals to replicate the modules at low cost. This book enables readers to gain experiences on side-channel attacks, fault-injection attacks, optical probing attack, PUF, TRNGs, odometer, hardware Trojan insertion and detection, logic locking insertion and assessment, and more.
Author: Laxman Raju Thoutam
Publisher: Springer Nature
ISBN: 9811913129
Category : Science
Languages : en
Pages : 472
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Book Description
This book serves as a quick guide on the latest material systems including their synthesis, fabrication and characterization techniques. It discusses recent developments in different material systems and discusses their novel applications in various branches of science and engineering. The book briefs latest computational tools and techniques that are used to discover new material systems. The book also briefs applications of new emerging materials in various fields including, healthcare, sensors, opto-electronics, high power devices and nano-electronics. This book helps to create a synergy between computational and experimental research methods to better understand a particular material system.
Author: Cher Ming Tan
Publisher: Woodhead Publishing
ISBN: 012822407X
Category : Technology & Engineering
Languages : en
Pages : 190
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Book Description
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author: Francesco Branz
Publisher: Elsevier
ISBN: 0128245425
Category : Technology & Engineering
Languages : en
Pages : 838
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Book Description
Next Generation of CubeSats and SmallSats: Enabling Technologies, Missions, and Markets provides a comprehensive understanding of the small and medium sized satellite approach and its potentialities and limitations. The book analyzes promising applications (e.g., constellations and distributed systems, small science platforms that overachieve relative to their development time and cost) as paradigm-shifting solutions for space exploitation, with an analysis of market statistics and trends and a prediction of where the technologies, and consequently, the field is heading in the next decade. The book also provides a thorough analysis of CubeSat potentialities and applications, and addresses unique technical approaches and systems strategies. Throughout key sections (introduction and background, technology details, systems, applications, and future prospects), the book provides basic design tools scaled to the small satellite problem, assesses the technological state-of-the-art, and describes the most recent advancements with a look to the near future. This new book is for aerospace engineering professionals, advanced students, and designers seeking a broad view of the CubeSat world with a brief historical background, strategies, applications, mission scenarios, new challenges and upcoming advances. - Presents a comprehensive and systematic view of the technologies and space missions related to nanosats and smallsats - Discusses next generation technologies, up-coming advancements and future perspectives - Features the most relevant CubeSat launch initiatives from NASA, ESA, and from developing countries, along with an overview of the New Space CubeSat market
Author: Tejinder Gandhi
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 719
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Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
