2021 22nd International Conference on Electronic Packaging Technology (ICEPT) PDF Download
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Author:
Publisher:
ISBN: 9781665413916
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN: 9781665413916
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: T.D. Subash
Publisher: CRC Press
ISBN: 1000889807
Category : Science
Languages : en
Pages : 199
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Book Description
This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.
Author: Baoyan Duan
Publisher: Springer Nature
ISBN: 9811913099
Category : Technology & Engineering
Languages : en
Pages : 2195
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Book Description
The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Author: Shanben Chen
Publisher: Springer Nature
ISBN: 981996136X
Category : Technology & Engineering
Languages : en
Pages : 129
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Book Description
The primary aim of this volume is to provide researchers and engineers from both academic and industry with up-to-date coverage of new results in the field of robotic welding, intelligent systems and automation. The book is mainly based on papers selected from the 2022 International Conference on Robotic Welding, Intelligence and Automation (RWIA’2022) in Shanghai and Lanzhou, China. The articles show that the intelligentized welding manufacturing (IWM) is becoming an inevitable trend with the intelligentized robotic welding as the key technology. The volume is divided into four logical parts: Intelligent Techniques for Robotic Welding, Sensing of Arc Welding Processing, Modeling and Intelligent Control of Welding Processing, as well as Intelligent Control and its Applications in Engineering.
Author: Jian Li
Publisher: Springer Nature
ISBN: 981990451X
Category : Technology & Engineering
Languages : en
Pages : 1411
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Book Description
This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Author: Udai Pratap Rao
Publisher: Springer Nature
ISBN: 9819935695
Category : Computers
Languages : en
Pages : 424
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Book Description
This book constitutes refereed proceedings of the International Conference on Security, Privacy and Data Analytics, ISPDA 2022. The volume covers topics, including big data and analytics, cloud security and privacy, data intelligence, hardware security, network security, blockchain technology and distributed ledger, machine learning for security, and many others. The volume includes novel contributions and the latest developments from researchers across industry and academia working in security, privacy, and data analytics from technological and social perspectives. This book will emerge as a valuable reference for researchers, instructors, students, scientists, engineers, managers, and industry practitioners across the globe.
Author: Nosang Vincent Myung
Publisher: Frontiers Media SA
ISBN: 2889668843
Category : Science
Languages : en
Pages : 131
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Book Description
Author: Chong Leong, Gan
Publisher: Springer Nature
ISBN: 3031267087
Category : Computers
Languages : en
Pages : 223
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Book Description
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Author: Lazaros Iliadis
Publisher: Springer Nature
ISBN: 3031624955
Category :
Languages : en
Pages : 603
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Book Description
Author: Vazgen Melikyan
Publisher: Springer Nature
ISBN: 3031507142
Category : Technology & Engineering
Languages : en
Pages : 351
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Book Description
This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
