2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). PDF Download
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Author:
Publisher:
ISBN: 9781538676684
Category : Electronic packaging
Languages : en
Pages :
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Author:
Publisher:
ISBN: 9781538676684
Category : Electronic packaging
Languages : en
Pages :
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Book Description
Author: Jeremy Witzens
Publisher: Springer Nature
ISBN: 3031633784
Category :
Languages : en
Pages : 598
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Author:
Publisher:
ISBN: 9781665416191
Category :
Languages : en
Pages :
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Author: Hammad M. Cheema
Publisher: Artech House
ISBN: 1608078191
Category : Technology & Engineering
Languages : en
Pages : 275
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Book Description
Antennas are essential part of every wireless communication system. The increasing trend of applications in the radio frequency (RF) and millimeter wave frequency spectrum has reduced the antenna sizes to only a few millimeters, which makes it practical for on-chip implementations. Integrated Circuit (IC) designers who have traditionally remained isolated from antenna design now need to understand its design process and trade-offs. This comprehensive resource addresses the challenges, benefits and trade-offs of on-chip antenna implementation. It presents practical design and integration considerations of the IC and antenna combination and how both ends of the system can be utilized in a complimentary way. The book includes on-chip antenna layout considerations, layout for testability and various methods of their characterization. A look at the future trends and utilization of on-chip antennas for different applications concludes the book.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556651
Category : Technology & Engineering
Languages : en
Pages : 462
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author:
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Category :
Languages : en
Pages :
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Author: Dongkai Shangguan
Publisher: CRC Press
ISBN: 1040028640
Category : Technology & Engineering
Languages : en
Pages : 463
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Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author: Thiam Beng Lim
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 492
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Book Description
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Author: Dong Xiang
Publisher: Frontiers Media SA
ISBN: 2889746496
Category : Technology & Engineering
Languages : en
Pages : 138
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Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
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