2003 International Symposium on Microelectronics

2003 International Symposium on Microelectronics PDF Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 1046

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Book Description

2003 International Symposium on Microelectronics

2003 International Symposium on Microelectronics PDF Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 1046

Get Book Here

Book Description


Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging PDF Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471

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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices

Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices PDF Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332

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Book Description


Ceramic Interconnect Technology Handbook

Ceramic Interconnect Technology Handbook PDF Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 458

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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Advanced VLSI Design and Testability Issues

Advanced VLSI Design and Testability Issues PDF Author: Suman Lata Tripathi
Publisher: CRC Press
ISBN: 1000168158
Category : Technology & Engineering
Languages : en
Pages : 379

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Book Description
This book facilitates the VLSI-interested individuals with not only in-depth knowledge, but also the broad aspects of it by explaining its applications in different fields, including image processing and biomedical. The deep understanding of basic concepts gives you the power to develop a new application aspect, which is very well taken care of in this book by using simple language in explaining the concepts. In the VLSI world, the importance of hardware description languages cannot be ignored, as the designing of such dense and complex circuits is not possible without them. Both Verilog and VHDL languages are used here for designing. The current needs of high-performance integrated circuits (ICs) including low power devices and new emerging materials, which can play a very important role in achieving new functionalities, are the most interesting part of the book. The testing of VLSI circuits becomes more crucial than the designing of the circuits in this nanometer technology era. The role of fault simulation algorithms is very well explained, and its implementation using Verilog is the key aspect of this book. This book is well organized into 20 chapters. Chapter 1 emphasizes on uses of FPGA on various image processing and biomedical applications. Then, the descriptions enlighten the basic understanding of digital design from the perspective of HDL in Chapters 2–5. The performance enhancement with alternate material or geometry for silicon-based FET designs is focused in Chapters 6 and 7. Chapters 8 and 9 describe the study of bimolecular interactions with biosensing FETs. Chapters 10–13 deal with advanced FET structures available in various shapes, materials such as nanowire, HFET, and their comparison in terms of device performance metrics calculation. Chapters 14–18 describe different application-specific VLSI design techniques and challenges for analog and digital circuit designs. Chapter 19 explains the VLSI testability issues with the description of simulation and its categorization into logic and fault simulation for test pattern generation using Verilog HDL. Chapter 20 deals with a secured VLSI design with hardware obfuscation by hiding the IC’s structure and function, which makes it much more difficult to reverse engineer.

Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems, 2007: Micro and nano systems ; Micro and nano devices ; Micro and nano mechanics ; Energy and micro and nano scale heat transfer

Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems, 2007: Micro and nano systems ; Micro and nano devices ; Micro and nano mechanics ; Energy and micro and nano scale heat transfer PDF Author:
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1016

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Book Description


Mems for Automotive and Aerospace Applications

Mems for Automotive and Aerospace Applications PDF Author: Michael Kraft
Publisher: Elsevier
ISBN: 0857096486
Category : Technology & Engineering
Languages : en
Pages : 358

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Book Description
MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for aerospace applications, including devices for active drag reduction in aerospace applications, inertial navigation and structural health monitoring systems, and thrusters for nano- and pico-satellites. A selection of case studies are used to explore MEMS for harsh environment sensors in aerospace applications, before the book concludes by considering the use of MEMS in space exploration and exploitation.With its distinguished editors and international team of expert contributors, MEMS for automotive and aerospace applications is a key tool for MEMS manufacturers and all scientists, engineers and academics working on MEMS and intelligent systems for transportation. - Chapters consider the role of MEMS in a number of automotive applications, including passenger safety and comfort, vehicle stability and control - MEMS for aerospace applications are also discussed, including active drag reduction, inertial navigation and structural health monitoring systems - Presents a number of case studies exploring MEMS for harsh environment sensors in aerospace

Biomedical Materials

Biomedical Materials PDF Author: Roger Narayan
Publisher: Springer Nature
ISBN: 3030492060
Category : Technology & Engineering
Languages : en
Pages : 720

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Book Description
This second edition provides a comprehensive discussion of contemporary materials used in biomedical research and development. The pedagogical writing style and structure provides students with an understanding of the fundamental concepts necessary to pursue research and industrial work in this growing area of biomedical science, including characteristics of biomaterials, biological processes, biocompatibility, and applications of materials in implants and medical instruments. Written by leading researchers in the field, this volume highlights important topics associated with biomedical engineering, medicine and surgery. The revised text contains updates that reflect recent technological advances in biomedical materials. It contains information on new characterization methods and applications for biomedical materials and incorporates suggestions that were offered by readers and educators using the first edition over the years. This textbook takes the reader to the forefront of biomedical materials development, providing graduate students with a taste of how the field is changing, while also serving as a useful reference to physicians and engineers.

Nanopackaging

Nanopackaging PDF Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 0387473262
Category : Technology & Engineering
Languages : en
Pages : 553

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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Enabling Technology for MEMS and Nanodevices

Enabling Technology for MEMS and Nanodevices PDF Author: Henry Baltes
Publisher: John Wiley & Sons
ISBN: 3527675043
Category : Technology & Engineering
Languages : en
Pages : 441

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Book Description
Mikro- und Nanotechnik haben Wissenschaft und Forschung revolutioniert. In Zukunft werden sie auch den Alltag verändern. Nun liegt der erste Band einer neuen Buchreihe vor: Advanced Micro and Nano Systems 1. Henry Baltes und seine Co-Autoren knüpfen mit AMN an die Sensors Update-Reihe an. Das Autorenteam wurde um weitere Experten erweitert. AMN wird zwei Mal pro Jahr mit einem neuen Band die aktuellen Entwicklungen in der Mikro- und Nano-Welt begleiten. Die Erforschung und der Einsatz von Mikro- und Nanosystemen sind eines der brandaktuellen Themen im Wissenschaftsbereich. Die Forschungsergebnisse werden mehr und mehr auch konkret umgesetzt. Damit werden Mikro- und Nanotechnologie zu Wirtschaftsfaktoren. Aktuelle Entwicklungen, neue Technologien, Nano-Bauelemente und Systeme im Mikromaßstab - Advanced Micro and Nano Systems, die neue Buchreihe, wird Spiegel der spannenden und faszinierenden Mikro- und Nano-Welt sein. Zweimal pro Jahr wird es einen neuen AMN-Band geben. Die Autoren sind ausgewiesene Spezialisten. Zu den Herausgebern zählt Henry Baltes, Professor an der ETH Zürich. Er zeichnete bereits für die Bände der Sensors Update-Reihe verantwortlich. Die Artikel ermöglichen Neueinsteigern einen ersten Zugriff auf die Materie. Fachleute erhalten einen umfassenden Überblick. Anspruch der Herausgeber ist es, nicht nur die theoretischen Grundlagen von Mikro- und Nanosystemen zu reflektieren, sondern immer auch praktische Möglichkeiten und die Grenzen der Anwendung im Blick zu haben. Die AMN-Bände sind Handbücher und Nachschlagewerke in einem. Die Reihe richtet sich an Vertreter unterschiedlicher Fachrichtungen: Biologie, Chemie, Mathematik, Sensorindustrie und Materialwissenschaften.