1997 International Symposium on Microelectronics PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download 1997 International Symposium on Microelectronics PDF full book. Access full book title 1997 International Symposium on Microelectronics by . Download full books in PDF and EPUB format.
Author:
Publisher: International Society for Hybrid Microelectronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 738
Get Book Here
Book Description
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author:
Publisher: International Society for Hybrid Microelectronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 738
Get Book Here
Book Description
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 992
Get Book Here
Book Description
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332
Get Book Here
Book Description
Author: Lars Niklasson
Publisher: Springer Science & Business Media
ISBN: 1447115996
Category : Computers
Languages : en
Pages : 1197
Get Book Here
Book Description
ICANN, the International Conference on Artificial Neural Networks, is the official conference series of the European Neural Network Society which started in Helsinki in 1991. Since then ICANN has taken place in Brighton, Amsterdam, Sorrento, Paris, Bochum and Lausanne, and has become Europe's major meeting in the field of neural networks. This book contains the proceedings of ICANN 98, held 2-4 September 1998 in Skovde, Sweden. Of 340 submissions to ICANN 98, 180 were accepted for publication and presentation at the conference. In addition, this book contains seven invited papers presented at the conference. A conference of this size is obviously not organized by three individuals alone. We therefore would like to thank the following people and organizations for supporting ICANN 98 in one way or another: • the European Neural Network Society and the Swedish Neural Network Society for their active support in the organization of this conference, • the Programme Committee and all reviewers for the hard and timely work that was required to produce more than 900 reviews during April 1998, • the Steering Committee which met in Skovde in May 1998 for the final selection of papers and the preparation of the conference program, • the other Module Chairs: Bengt Asker (Industry and Research), Harald Brandt (Applications), Anders Lansner (Computational Neuroscience and Brain Theory), Thorsteinn Rognvaldsson (Theory), Noel Sharkey (co chair Autonomous Robotics and Adaptive Behavior), Bertil Svensson (Hardware and Implementations), • the conference secretary, Leila Khammari, and the rest of the
Author:
Publisher: DIANE Publishing
ISBN: 1428918248
Category :
Languages : en
Pages : 203
Get Book Here
Book Description
Author: Cornelius T. Leondes
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
Get Book Here
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
Get Book Here
Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author: Ernst Kussul
Publisher: Springer Science & Business Media
ISBN: 3642025358
Category : Computers
Languages : en
Pages : 225
Get Book Here
Book Description
Micromechanical manufacturing based on microequipment creates new possibi- ties in goods production. If microequipment sizes are comparable to the sizes of the microdevices to be produced, it is possible to decrease the cost of production drastically. The main components of the production cost - material, energy, space consumption, equipment, and maintenance - decrease with the scaling down of equipment sizes. To obtain really inexpensive production, labor costs must be reduced to almost zero. For this purpose, fully automated microfactories will be developed. To create fully automated microfactories, we propose using arti?cial neural networks having different structures. The simplest perceptron-like neural network can be used at the lowest levels of microfactory control systems. Adaptive Critic Design, based on neural network models of the microfactory objects, can be used for manufacturing process optimization, while associative-projective neural n- works and networks like ART could be used for the highest levels of control systems. We have examined the performance of different neural networks in traditional image recognition tasks and in problems that appear in micromechanical manufacturing. We and our colleagues also have developed an approach to mic- equipment creation in the form of sequential generations. Each subsequent gene- tion must be of a smaller size than the previous ones and must be made by previous generations. Prototypes of ?rst-generation microequipment have been developed and assessed.
Author: Grace M. Davidson
Publisher: ASM International
ISBN: 1615030824
Category : Technology & Engineering
Languages : en
Pages : 310
Get Book Here
Book Description
Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
Get Book Here
Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
