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Author: Michail Maniatakos
Publisher: Springer
ISBN: 303015663X
Category : Computers
Languages : en
Pages : 271
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Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Michail Maniatakos
Publisher: Springer
ISBN: 303015663X
Category : Computers
Languages : en
Pages : 271
Get Book Here
Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Thomas Hollstein
Publisher: Springer
ISBN: 3319671049
Category : Computers
Languages : en
Pages : 247
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Book Description
This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design.
Author: Michail Maniatakos
Publisher:
ISBN: 9783030156640
Category : Integrated circuits
Languages : en
Pages : 257
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Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Carolina Metzler
Publisher: Springer Nature
ISBN: 3030532739
Category : Computers
Languages : en
Pages : 355
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Book Description
This book contains extended and revised versions of the best papers presented at the 27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, held in Cusco, Peru, in October 2019. The 15 full papers included in this volume were carefully reviewed and selected from the 28 papers (out of 82 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
Author: Massimo Alioto
Publisher: Springer
ISBN: 3319514822
Category : Technology & Engineering
Languages : en
Pages : 527
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Book Description
This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia. After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT: ultra-low power digital architectures and circuits low- and zero-leakage memories (including emerging technologies) circuits for hardware security and authentication System on Chip design methodologies on-chip power management and energy harvesting ultra-low power analog interfaces and analog-digital conversion short-range radios miniaturized battery technologies packaging and assembly of IoT integrated systems (on silicon and non-silicon substrates). As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry. The unique balance between breadth and depth of this book: enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable future provides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected references makes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).
Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000404935
Category : Science
Languages : en
Pages : 275
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Book Description
Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.
Author: Rajiv Pandey
Publisher: Academic Press
ISBN: 0128240555
Category : Science
Languages : en
Pages : 516
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Book Description
Artificial Intelligence and Machine Learning for Predictive and Analytical Rendering in Edge Computing focuses on the role of AI and machine learning as it impacts and works alongside Edge Computing. Sections cover the growing number of devices and applications in diversified domains of industry, including gaming, speech recognition, medical diagnostics, robotics and computer vision and how they are being driven by Big Data, Artificial Intelligence, Machine Learning and distributed computing, may it be Cloud Computing or the evolving Fog and Edge Computing paradigms. Challenges covered include remote storage and computing, bandwidth overload due to transportation of data from End nodes to Cloud leading in latency issues, security issues in transporting sensitive medical and financial information across larger gaps in points of data generation and computing, as well as design features of Edge nodes to store and run AI/ML algorithms for effective rendering. - Provides a reference handbook on the evolution of distributed systems, including Cloud, Fog and Edge Computing - Integrates the various Artificial Intelligence and Machine Learning techniques for effective predictions at Edge rather than Cloud or remote Data Centers - Provides insight into the features and constraints in Edge Computing and storage, including hardware constraints and the technological/architectural developments that shall overcome those constraints
Author: Nadine Collaert
Publisher: Elsevier
ISBN: 0128234504
Category : Technology & Engineering
Languages : en
Pages : 369
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Book Description
New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. - Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies - Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) - Focuses on mm-wave frequencies up to the terahertz regime
Author: Dr. M. Maheswaran
Publisher: RK Publication
ISBN: 8197398348
Category : Technology & Engineering
Languages : en
Pages : 247
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Book Description
VLSI and Chip Design exploration of Very Large-Scale Integration (VLSI) technology and the intricacies of modern chip design. It fundamental principles, advanced methodologies, and the latest innovations in circuit design, fabrication, and testing. With a focus on digital and analog systems, this integrates theoretical concepts with practical applications, catering to both beginners and professionals. It emphasizes design optimization, power efficiency, and scalability, making it an essential resource for engineers, researchers, and students aspiring to excel in semiconductor technology and integrated circuit design.
Author: Subhas Chandra Mukhopadhyay
Publisher: Springer Science & Business Media
ISBN: 3319042238
Category : Technology & Engineering
Languages : en
Pages : 259
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Book Description
Advancement in sensor technology, smart instrumentation, wireless sensor networks, miniaturization, RFID and information processing is helping towards the realization of Internet of Things (IoT). IoTs are finding applications in various area applications including environmental monitoring, intelligent buildings, smart grids and so on. This book provides design challenges of IoT, theory, various protocols, implementation issues and a few case study. The book will be very useful for postgraduate students and researchers to know from basics to implementation of IoT.
