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Author: Ricardo Reis
Publisher: Springer
ISBN: 0387895582
Category : Computers
Languages : en
Pages : 315
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Book Description
This book contains extended and revised versions of the best papers that were presented during the fifteenth edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 15th conference was held at the Georgia Institute of Technology, Atlanta, USA (October 15-17, 2007). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth and Nice. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SoC conferences aim to address these exciting new issues.
Author: Ricardo Reis
Publisher: Springer
ISBN: 0387895582
Category : Computers
Languages : en
Pages : 315
Get Book Here
Book Description
This book contains extended and revised versions of the best papers that were presented during the fifteenth edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 15th conference was held at the Georgia Institute of Technology, Atlanta, USA (October 15-17, 2007). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth and Nice. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SoC conferences aim to address these exciting new issues.
Author: Michail Maniatakos
Publisher: Springer
ISBN: 303015663X
Category : Computers
Languages : en
Pages : 271
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Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Antonio Carlos Schneider Beck
Publisher: Springer Science & Business Media
ISBN: 1461417465
Category : Technology & Engineering
Languages : en
Pages : 321
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Book Description
As embedded systems become more complex, designers face a number of challenges at different levels: they need to boost performance, while keeping energy consumption as low as possible, they need to reuse existent software code, and at the same time they need to take advantage of the extra logic available in the chip, represented by multiple processors working together. This book describes several strategies to achieve such different and interrelated goals, by the use of adaptability. Coverage includes reconfigurable systems, dynamic optimization techniques such as binary translation and trace reuse, new memory architectures including homogeneous and heterogeneous multiprocessor systems, communication issues and NOCs, fault tolerance against fabrication defects and soft errors, and finally, how one can combine several of these techniques together to achieve higher levels of performance and adaptability. The discussion also includes how to employ specialized software to improve this new adaptive system, and how this new kind of software must be designed and programmed.
Author: Robert Wille
Publisher: Springer Science & Business Media
ISBN: 9048195799
Category : Technology & Engineering
Languages : en
Pages : 192
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Book Description
The development of computing machines found great success in the last decades. But the ongoing miniaturization of integrated circuits will reach its limits in the near future. Shrinking transistor sizes and power dissipation are the major barriers in the development of smaller and more powerful circuits. Reversible logic p- vides an alternative that may overcome many of these problems in the future. For low-power design, reversible logic offers signi?cant advantages since zero power dissipation will only be possible if computation is reversible. Furthermore, quantum computation pro?ts from enhancements in this area, because every quantum circuit is inherently reversible and thus requires reversible descriptions. However, since reversible logic is subject to certain restrictions (e.g. fanout and feedback are not directly allowed), the design of reversible circuits signi?cantly differs from the design of traditional circuits. Nearly all steps in the design ?ow (like synthesis, veri?cation, or debugging) must be redeveloped so that they become applicable to reversible circuits as well. But research in reversible logic is still at the beginning. No continuous design ?ow exists so far. Inthisbook,contributionstoadesign?owforreversiblelogicarepresented.This includes advanced methods for synthesis, optimization, veri?cation, and debugging.
Author: Marcel Walter
Publisher: Springer Nature
ISBN: 3030899527
Category : Technology & Engineering
Languages : en
Pages : 201
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Book Description
This book discusses the main tasks of Design Automation for Field-coupled Nanocomputing (FCN) technologies, in order to enable large-scale composition of elementary building blocks, that obtain correct systems from given function specifications. To this end, a holistic design flow is described, which covers exact and scalable placement & routing, one-pass logic synthesis, novel clocking mechanisms for data synchronization, and formal verification for obtained circuit layouts. Additionally, theoretical groundwork is presented that lays the foundation for any algorithmic consideration in the future. Furthermore, an open-source FCN design framework called fiction, which contains implementations of all proposed techniques, is presented and made publicly available. The approaches discussed in this book address obstacles that have existed since the conceptualization of the FCN paradigm and could not be resolved since then. As a result, this book substantially advances the state of the art in design automation for FCN technologies.
Author: Nima Aghaee Ghaleshahi
Publisher: Linköping University Electronic Press
ISBN: 9176859495
Category :
Languages : en
Pages : 219
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Book Description
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Author: Kalyan Biswas
Publisher: John Wiley & Sons
ISBN: 1394188943
Category : Technology & Engineering
Languages : en
Pages : 340
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Book Description
Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.
Author: Andy Pimentel
Publisher: Springer Science & Business Media
ISBN: 3540223770
Category : Computers
Languages : en
Pages : 570
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Book Description
This book constitutes the refereed proceedings of the 4th International Workshop on Systems, Architectures, Modeling, and Simulation, SAMOS 2004, held in Samos, Greece on July 2004. Besides the SAMOS 2004 proceedings, the book also presents 19 revised papers from the predecessor workshop SAMOS 2003. The 55 revised full papers presented were carefully reviewed and selected for inclusion in the book. The papers are organized in topical sections on reconfigurable computing, architectures and implementation, and systems modeling and simulation.
Author: Wael Badawy
Publisher: Springer Science & Business Media
ISBN: 1461503515
Category : Technology & Engineering
Languages : en
Pages : 464
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Book Description
System-on-Chip for Real-Time Applications will be of interest to engineers, both in industry and academia, working in the area of SoC VLSI design and application. It will also be useful to graduate and undergraduate students in electrical and computer engineering and computer science. A selected set of papers from the 2nd International Workshop on Real-Time Applications were used to form the basis of this book. It is organized into the following chapters: -Introduction; -Design Reuse; -Modeling; -Architecture; -Design Techniques; -Memory; -Circuits; -Low Power; -Interconnect and Technology; -MEMS. System-on-Chip for Real-Time Applications contains many signal processing applications and will be of particular interest to those working in that community.
Author: Veena S. Chakravarthi
Publisher: Springer Science & Business Media
ISBN: 8132215249
Category : Technology & Engineering
Languages : en
Pages : 464
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Book Description
This book is a collection of papers presented by renowned researchers, keynote speakers, and academicians in the International Conference on VLSI, Communication, Analog Designs, Signals & Systems and Networking (VCASAN-2013), organized by B.N.M. Institute of Technology, Bangalore, India during July 17–19, 2013. The book provides global trends in cutting-edge technologies in electronics and communication engineering. The content of the book is useful to engineers, researchers, and academicians as well as industry professionals.
