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Author: Ricardo A. Reis
Publisher: Springer
ISBN: 0387353119
Category : Computers
Languages : en
Pages : 569
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Book Description
This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and image processing, low power battery operation and wireless communication. The papers as presented in Jhis book have been organized in two tracks, where one is dealing with VLSI System Design and Applications and the other presents VLSI Design Methods and CAD. The following topics are addressed: VLSI System Design and Applications Track • VLSI for Video and Image Processing. • Microsystem and Mixed-mode design. • Communication And Memory System Design • Cow-voltage & Low-power Analog Circuits. • High Speed Circuit Techniques • Application Specific DSP Architectures. VLSI Design Methods and CAD Track • Specification and Simulation at System Level. • Synthesis and Technology Mapping. • CAD Techniques for Low-Power Design. • Physical Design Issues in Sub-micron Technologies. • Architectural Design and Synthesis. • Testing in Complex Mixed Analog and Digital Systems.
Author: Ricardo A. Reis
Publisher: Springer
ISBN: 0387353119
Category : Computers
Languages : en
Pages : 569
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Book Description
This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and image processing, low power battery operation and wireless communication. The papers as presented in Jhis book have been organized in two tracks, where one is dealing with VLSI System Design and Applications and the other presents VLSI Design Methods and CAD. The following topics are addressed: VLSI System Design and Applications Track • VLSI for Video and Image Processing. • Microsystem and Mixed-mode design. • Communication And Memory System Design • Cow-voltage & Low-power Analog Circuits. • High Speed Circuit Techniques • Application Specific DSP Architectures. VLSI Design Methods and CAD Track • Specification and Simulation at System Level. • Synthesis and Technology Mapping. • CAD Techniques for Low-Power Design. • Physical Design Issues in Sub-micron Technologies. • Architectural Design and Synthesis. • Testing in Complex Mixed Analog and Digital Systems.
Author: Ricardo A. Reis
Publisher:
ISBN: 9781475769487
Category :
Languages : en
Pages : 588
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Book Description
Author: Stuart K. Tewksbury
Publisher: Springer Science & Business Media
ISBN: 1461316251
Category : Technology & Engineering
Languages : en
Pages : 456
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Book Description
From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Author: G. Cauwenberghs
Publisher: Springer Science & Business Media
ISBN: 9780792385554
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
Learning on Silicon combines models of adaptive information processing in the brain with advances in microelectronics technology and circuit design. The premise is to construct integrated systems not only loaded with sufficient computational power to handle demanding signal processing tasks in sensory perception and pattern recognition, but also capable of operating autonomously and robustly in unpredictable environments through mechanisms of adaptation and learning. This edited volume covers the spectrum of Learning on Silicon in five parts: adaptive sensory systems, neuromorphic learning, learning architectures, learning dynamics, and learning systems. The 18 chapters are documented with examples of fabricated systems, experimental results from silicon, and integrated applications ranging from adaptive optics to biomedical instrumentation. As the first comprehensive treatment on the subject, Learning on Silicon serves as a reference for beginners and experienced researchers alike. It provides excellent material for an advanced course, and a source of inspiration for continued research towards building intelligent adaptive machines.
Author: Chuan Seng Tan
Publisher: CRC Press
ISBN: 9814303828
Category : Science
Languages : en
Pages : 376
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Book Description
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Author: Ricardo Reis
Publisher: Springer
ISBN: 0387736611
Category : Technology & Engineering
Languages : en
Pages : 342
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Book Description
This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC 10 International Conference on Very Large Scale Integration, a Global System-on-Chip Design and CAD conference. This conference provides a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design.
Author: Kurt Hoffmann
Publisher: John Wiley & Sons
ISBN: 0470020695
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
The development of large-scale integrated systems on a chip has had a dramatic effect on circuit design methodology. Recent years have seen an escalation of interest in systems level integration (system-on-a-chip) and the development of low power, high chip density circuits and systems. Kurt Hoffmann sets out to address a wide range of issues relating to the design and integration of integrated circuit components and provides readers with the methodology by which simple equations for the estimation of transistor geometries and circuit behaviour can be deduced. The broad coverage of this unique book ranges from field effect transistor design, MOS transistor modelling and the fundamentals of digital CMOS circuit design through to MOS memory architecture and design. Highlights the increasing requirement for information on system-on-a-chip design and integration. Combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one volume for the first time. Written with the aim of bridging the gap between semiconductor device physics and practical circuit design. Introduces the basic behaviour of semiconductor components for ICs and covers the design of both digital and analog circuits in CMOS and BiCMOS technologies. Broad coverage will appeal to both students and practising engineers alike. Written by a respected expert in the field with a proven track record of publications in this field. Drawing upon considerable experience within both industry and academia, Hoffmann’s outstanding text, will prove an invaluable resource for designers, practising engineers in the semiconductor device field and electronics systems industry as well as Postgraduate students of microelectronics, electrical and computer engineering.
Author: Wayne Wolf
Publisher: Prentice Hall
ISBN:
Category : Computers
Languages : en
Pages : 600
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Book Description
Techniques for the latest deep-submicron, mega-chip projects. The start-to-finish, state-of-the-art guide to VLSI design. VLSI design is system design. To build high-performance, cost-effective ICs, you must understand all aspects of digital design, from planning and layout to fabrication and packaging. Modern VLSI Design, Second Edition: Systems on Silicon is a comprehensive, "bottom-up" guide to the entire VLSI design process. Emphasizing CMOS, it focuses on the crucial challenges of deep-submicron VLSI design. Coverage includes: Devices and layouts: transistor structures and characteristics, wires, vias, parasitics, design rules, layout design and tools. Logic gates and combinational logic networks, including interconnect delay and crosstalk. Sequential machines and sequential system design. Subsystem design, including high-speed adders, multipliers, ROM, SRAM, SRAM, PGAs and PLAs. Floorplanning, clock distribution and power distribution. Architecture design, including VHDL, scheduling, function unit selection, power and testability. Chip design methodologies, CAD systems and algorithms. Modern VLSI Design, Second Edition: Systems on Silicon offers a complete yet accessible introduction to crosstalk models and optimization. It covers minimizing power consumption at every level of abstraction, from circuits to architecture and new insights into design-for-testability techniques that maximize quality despite quicker turnarounds. It also presents detailed coverage of the algorithms underlying contemporary VLSI computer-aided design software, so designers can understand their tools nomatter which ones they choose. Whether you're a practicing professional or advanced student, this is the sophisticated VLSI design knowledge you need to succeed with tomorrow's most challenging projects.
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Giovanni DeMicheli
Publisher: Springer Science & Business Media
ISBN: 9789024735624
Category : Technology & Engineering
Languages : en
Pages : 668
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Book Description
Proceedings of the NATO Advanced Study Institute, L'Aquila, Italy, July 7-18, 1986
