Author: Ulrich H. P. Fischer-Hirchert
Publisher: Cuvillier Verlag
ISBN: 3867271976
Category :
Languages : de
Pages : 64
Book Description
Fünfter ITG-Workshop Photonische Aufbau- und Verbindungstechnik
Author: Ulrich H. P. Fischer-Hirchert
Publisher: Cuvillier Verlag
ISBN: 3867271976
Category :
Languages : de
Pages : 64
Book Description
Publisher: Cuvillier Verlag
ISBN: 3867271976
Category :
Languages : de
Pages : 64
Book Description
Photonics Packaging, Integration, and Interconnects
Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 286
Book Description
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 286
Book Description
VII. ITG-Workshop Photonische Aufbau- und Verbindungstechnik
Author: Ulrich H. P. Fischer-Hirchert
Publisher: Cuvillier Verlag
ISBN: 3736930089
Category : Technology & Engineering
Languages : de
Pages : 128
Book Description
Publisher: Cuvillier Verlag
ISBN: 3736930089
Category : Technology & Engineering
Languages : de
Pages : 128
Book Description
Photonic Packaging Sourcebook
Author: Ulrich H. P. Fischer-Hirchert
Publisher: Springer
ISBN: 3642253768
Category : Technology & Engineering
Languages : en
Pages : 336
Book Description
This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
Publisher: Springer
ISBN: 3642253768
Category : Technology & Engineering
Languages : en
Pages : 336
Book Description
This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
VII. ITG-Workshop Photonische Aufbau- und Verbindungstechnik
Author: Ulrich H. P. Fischer-Hirchert
Publisher:
ISBN: 9783869550084
Category :
Languages : de
Pages : 121
Book Description
Publisher:
ISBN: 9783869550084
Category :
Languages : de
Pages : 121
Book Description
Optical Interconnects for Data Centers
Author: Tolga Tekin
Publisher: Woodhead Publishing
ISBN: 008100513X
Category : Computers
Languages : en
Pages : 431
Book Description
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Publisher: Woodhead Publishing
ISBN: 008100513X
Category : Computers
Languages : en
Pages : 431
Book Description
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Silicon Systems for Wireless LAN
Author: Zoran Stamenkovic
Publisher: World Scientific Publishing (Uk)Limited
ISBN: 9789811210716
Category : Computers
Languages : en
Pages : 400
Book Description
Today's integrated silicon circuits and systems for wireless communications are of a huge complexity. This unique compendium covers all the steps (from the system-level to the transistor-level) necessary to design, model, verify, implement, and test a silicon system. It bridges the gap between the system-world and the transistor-world (between communication, system, circuit, device, and test engineers). It is extremely important nowadays (and will be more important in the future) for communication, system, and circuit engineers to understand the physical implications of system and circuit solutions based on hardware/software co-design as well as for device and test engineers to cope with the system and circuit requirements in terms of power, speed, and data throughput.
Publisher: World Scientific Publishing (Uk)Limited
ISBN: 9789811210716
Category : Computers
Languages : en
Pages : 400
Book Description
Today's integrated silicon circuits and systems for wireless communications are of a huge complexity. This unique compendium covers all the steps (from the system-level to the transistor-level) necessary to design, model, verify, implement, and test a silicon system. It bridges the gap between the system-world and the transistor-world (between communication, system, circuit, device, and test engineers). It is extremely important nowadays (and will be more important in the future) for communication, system, and circuit engineers to understand the physical implications of system and circuit solutions based on hardware/software co-design as well as for device and test engineers to cope with the system and circuit requirements in terms of power, speed, and data throughput.
2021 IEEE Asia-Pacific Microwave Conference (APMC).
Author:
Publisher:
ISBN: 9781665437820
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781665437820
Category :
Languages : en
Pages :
Book Description
Theory Of Superconductivity
Author: J. Robert Schrieffer
Publisher: CRC Press
ISBN: 0429964250
Category : Science
Languages : en
Pages : 352
Book Description
Theory of Superconductivity is primarily intended to serve as a background for reading the literature in which detailed applications of the microscopic theory of superconductivity are made to specific problems.
Publisher: CRC Press
ISBN: 0429964250
Category : Science
Languages : en
Pages : 352
Book Description
Theory of Superconductivity is primarily intended to serve as a background for reading the literature in which detailed applications of the microscopic theory of superconductivity are made to specific problems.
CESAR - Cost-efficient Methods and Processes for Safety-relevant Embedded Systems
Author: Ajitha Rajan
Publisher: Springer Science & Business Media
ISBN: 3709113873
Category : Technology & Engineering
Languages : en
Pages : 403
Book Description
The book summarizes the findings and contributions of the European ARTEMIS project, CESAR, for improving and enabling interoperability of methods, tools, and processes to meet the demands in embedded systems development across four domains - avionics, automotive, automation, and rail. The contributions give insight to an improved engineering and safety process life-cycle for the development of safety critical systems. They present new concept of engineering tools integration platform to improve the development of safety critical embedded systems and illustrate capacity of this framework for end-user instantiation to specific domain needs and processes. They also advance state-of-the-art in component-based development as well as component and system validation and verification, with tool support. And finally they describe industry relevant evaluated processes and methods especially designed for the embedded systems sector as well as easy adoptable common interoperability principles for software tool integration.
Publisher: Springer Science & Business Media
ISBN: 3709113873
Category : Technology & Engineering
Languages : en
Pages : 403
Book Description
The book summarizes the findings and contributions of the European ARTEMIS project, CESAR, for improving and enabling interoperability of methods, tools, and processes to meet the demands in embedded systems development across four domains - avionics, automotive, automation, and rail. The contributions give insight to an improved engineering and safety process life-cycle for the development of safety critical systems. They present new concept of engineering tools integration platform to improve the development of safety critical embedded systems and illustrate capacity of this framework for end-user instantiation to specific domain needs and processes. They also advance state-of-the-art in component-based development as well as component and system validation and verification, with tool support. And finally they describe industry relevant evaluated processes and methods especially designed for the embedded systems sector as well as easy adoptable common interoperability principles for software tool integration.