Transient Modeling of Selective Chemical Vapor Deposition of Tungsten During a Via Filling Process

Transient Modeling of Selective Chemical Vapor Deposition of Tungsten During a Via Filling Process PDF Author: Yeongdae Shon
Publisher:
ISBN:
Category : Tungsten
Languages : en
Pages : 394

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Transient Modeling of Selective Chemical Vapor Deposition of Tungsten During a Via Filling Process

Transient Modeling of Selective Chemical Vapor Deposition of Tungsten During a Via Filling Process PDF Author: Yeongdae Shon
Publisher:
ISBN:
Category : Tungsten
Languages : en
Pages : 394

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Modeling of Chemical Vapor Deposition of Tungsten Films

Modeling of Chemical Vapor Deposition of Tungsten Films PDF Author: Chris R. Kleijn
Publisher: Birkhäuser
ISBN: 3034877412
Category : Science
Languages : en
Pages : 138

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Book Description
Semiconductor equipment modeling has in recent years become a field of great interest, because it offers the potential to support development and optimization of manufacturing equipment and hence reduce the cost and improve the quality of the reactors. This book is the result of two parallel lines of research dealing with the same subject - Modeling of Tungsten CVD processes -, which were per formed independently under very different boundary conditions. On the one side, Chris Kleijn, working in an academic research environment, was able to go deep enough into the subject to laya solid foundation and prove the validity of all the assumptions made in his work. On the other side, Christoph Werner, working in the context of an industrial research lab, was able to closely interact with manufacturing and development engineers in a modern submicron semiconductor processing line. Because of these different approaches, the informal collaboration during the course of the projects proved to be extremely helpful to both sides, even though - or perhaps because - different computer codes, different CVD reactors and also slightly different models were used. In spite of the inconsistencies which might arise from this double approach, we feel that the presentation of both sets of results in one book will be very useful for people working in similar projects.

Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences PDF Author: Wade H. Shafer
Publisher: Springer Science & Business Media
ISBN: 1461524539
Category : Science
Languages : en
Pages : 391

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Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the though that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemi nation. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 37 (thesis year 1992) a total of 12,549 thesis titles from 25 Canadian and 153 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 37 reports theses submitted in 1992, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.

Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI/ ULSI Applications

Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI/ ULSI Applications PDF Author: John E.J. Schmitz
Publisher: William Andrew
ISBN:
Category : Computers
Languages : en
Pages : 264

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Publisher description.

Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences PDF Author: W. H. Shafer
Publisher: Springer Science & Business Media
ISBN: 9780306447112
Category : Education
Languages : en
Pages : 410

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Book Description
Volume 37 (thesis year 1992) reports a total of 12,549 thesis titles from 25 Canadian and 153 US universities (theses submitted in previous years but only now reported are indicated by the thesis year shown in parenthesis). The organization, like that of past years, consists of thesis titles arrange

Study of Selective CVD Tungsten as a Diffusion Barrier for Electroless Copper Depositions

Study of Selective CVD Tungsten as a Diffusion Barrier for Electroless Copper Depositions PDF Author: Yeeli Lee
Publisher:
ISBN:
Category :
Languages : en
Pages : 96

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A Mathematical Model of the Slectivity Loss During Selective Tungsten Chemical Vapor Deposition by Hydrogen Reduction of Tungsten Hexafluoride

A Mathematical Model of the Slectivity Loss During Selective Tungsten Chemical Vapor Deposition by Hydrogen Reduction of Tungsten Hexafluoride PDF Author: Cheng-Wu Chang
Publisher:
ISBN:
Category :
Languages : en
Pages : 184

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Chemical Abstracts

Chemical Abstracts PDF Author:
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540

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Metals Abstracts

Metals Abstracts PDF Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1628

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Atomic Layer Deposition for Semiconductors

Atomic Layer Deposition for Semiconductors PDF Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266

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Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.