Author: F. Patrick McCluskey
Publisher: CRC Press
ISBN: 9780849396236
Category : Technology & Engineering
Languages : en
Pages : 354
Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
High Temperature Electronics
Author: F. Patrick McCluskey
Publisher: CRC Press
ISBN: 9780849396236
Category : Technology & Engineering
Languages : en
Pages : 354
Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Publisher: CRC Press
ISBN: 9780849396236
Category : Technology & Engineering
Languages : en
Pages : 354
Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 880
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 880
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
High Performance Computing
Author: Heike Jagode
Publisher: Springer Nature
ISBN: 303090539X
Category : Computers
Languages : en
Pages : 515
Book Description
This book constitutes the refereed post-conference proceedings of 9 workshops held at the 35th International ISC High Performance 2021 Conference, in Frankfurt, Germany, in June-July 2021: Second International Workshop on the Application of Machine Learning Techniques to Computational Fluid Dynamics and Solid Mechanics Simulations and Analysis; HPC-IODC: HPC I/O in the Data Center Workshop; Compiler-assisted Correctness Checking and Performance Optimization for HPC; Machine Learning on HPC Systems;4th International Workshop on Interoperability of Supercomputing and Cloud Technologies;2nd International Workshop on Monitoring and Operational Data Analytics;16th Workshop on Virtualization in High-Performance Cloud Computing; Deep Learning on Supercomputers; 5th International Workshop on In Situ Visualization. The 35 papers included in this volume were carefully reviewed and selected. They cover all aspects of research, development, and application of large-scale, high performance experimental and commercial systems. Topics include high-performance computing (HPC), computer architecture and hardware, programming models, system software, performance analysis and modeling, compiler analysis and optimization techniques, software sustainability, scientific applications, deep learning.
Publisher: Springer Nature
ISBN: 303090539X
Category : Computers
Languages : en
Pages : 515
Book Description
This book constitutes the refereed post-conference proceedings of 9 workshops held at the 35th International ISC High Performance 2021 Conference, in Frankfurt, Germany, in June-July 2021: Second International Workshop on the Application of Machine Learning Techniques to Computational Fluid Dynamics and Solid Mechanics Simulations and Analysis; HPC-IODC: HPC I/O in the Data Center Workshop; Compiler-assisted Correctness Checking and Performance Optimization for HPC; Machine Learning on HPC Systems;4th International Workshop on Interoperability of Supercomputing and Cloud Technologies;2nd International Workshop on Monitoring and Operational Data Analytics;16th Workshop on Virtualization in High-Performance Cloud Computing; Deep Learning on Supercomputers; 5th International Workshop on In Situ Visualization. The 35 papers included in this volume were carefully reviewed and selected. They cover all aspects of research, development, and application of large-scale, high performance experimental and commercial systems. Topics include high-performance computing (HPC), computer architecture and hardware, programming models, system software, performance analysis and modeling, compiler analysis and optimization techniques, software sustainability, scientific applications, deep learning.
1985 Long-range Program Plan
Author: United States. National Aeronautics and Space Administration
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 280
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 280
Book Description
NOAA Technical Report OOE.
Author:
Publisher:
ISBN:
Category : Ocean engineering
Languages : en
Pages : 244
Book Description
Publisher:
ISBN:
Category : Ocean engineering
Languages : en
Pages : 244
Book Description
Proceedings
Author: Instrument Society of America
Publisher:
ISBN:
Category : Automatic control
Languages : en
Pages : 670
Book Description
Publisher:
ISBN:
Category : Automatic control
Languages : en
Pages : 670
Book Description
NASA Tech Briefs
Author:
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 792
Book Description
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 792
Book Description
International Aerospace Abstracts
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 656
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 656
Book Description
Program Solicitation
Author:
Publisher:
ISBN:
Category : Military research
Languages : en
Pages : 972
Book Description
Publisher:
ISBN:
Category : Military research
Languages : en
Pages : 972
Book Description
Construction 4.0
Author: Marco Casini
Publisher: Woodhead Publishing
ISBN: 0128218037
Category : Technology & Engineering
Languages : en
Pages : 696
Book Description
Developments in data acquisition technologies, digital information and analysis, automated construction processes, and advanced materials and products have finally started to move the construction industry - traditionally reluctant to innovation and slow in adopting new technologies - toward a new era. Massive changes are occurring because of the possibilities created by Building information modeling, Extended reality, Internet of Things, Artificial intelligence and Machine Learning, Big data, Nanotechnology, 3D printing, and other advanced technologies, which are strongly interconnected and are driving the capabilities for much more efficient construction at scale. Construction 4.0: Advanced Technology, Tools and Materials for the Digital Transformation of the Construction Industry provides readers with a state-of-the-art review of the ongoing digital transformation of the sector within the new 4.0 framework, presenting a thorough investigation of the emerging trends, technologies, and strategies in the fields of smart building design, construction, and operation and providing a comprehensive guideline on how to exploit the new possibilities offered by the digital revolution. It will be an essential reference resource for academic researchers, material scientists and civil engineers, undergraduate and graduate students, and other professionals working in the field of smart ecoefficient construction and cutting-edge technologies applied to construction. - Provides an overview of the Construction 4.0 framework to address the global challenges of the buildingsector in the 21st century and an in-depth analysis of the most advanced digital technologies and systems forthe operation and maintenance of infrastructure, real estate, and other built assets - Covers major innovations across the value chain, including building design, fabrication, construction, operationand maintenance, and end-of-life - Illustrates the most advanced digital tools and methods to support the building design activity, includinggenerative design, virtual reality, and digital fabrication - Presents a thorough review of the most advanced construction materials, building methods, and techniquesfor a new connected and automated construction model - Explores the digital transformation for smart energy buildings and their integration with emerging smartgrids and smart cities - Reflects upon major findings and identifies emerging market opportunities for the whole AECO sector
Publisher: Woodhead Publishing
ISBN: 0128218037
Category : Technology & Engineering
Languages : en
Pages : 696
Book Description
Developments in data acquisition technologies, digital information and analysis, automated construction processes, and advanced materials and products have finally started to move the construction industry - traditionally reluctant to innovation and slow in adopting new technologies - toward a new era. Massive changes are occurring because of the possibilities created by Building information modeling, Extended reality, Internet of Things, Artificial intelligence and Machine Learning, Big data, Nanotechnology, 3D printing, and other advanced technologies, which are strongly interconnected and are driving the capabilities for much more efficient construction at scale. Construction 4.0: Advanced Technology, Tools and Materials for the Digital Transformation of the Construction Industry provides readers with a state-of-the-art review of the ongoing digital transformation of the sector within the new 4.0 framework, presenting a thorough investigation of the emerging trends, technologies, and strategies in the fields of smart building design, construction, and operation and providing a comprehensive guideline on how to exploit the new possibilities offered by the digital revolution. It will be an essential reference resource for academic researchers, material scientists and civil engineers, undergraduate and graduate students, and other professionals working in the field of smart ecoefficient construction and cutting-edge technologies applied to construction. - Provides an overview of the Construction 4.0 framework to address the global challenges of the buildingsector in the 21st century and an in-depth analysis of the most advanced digital technologies and systems forthe operation and maintenance of infrastructure, real estate, and other built assets - Covers major innovations across the value chain, including building design, fabrication, construction, operationand maintenance, and end-of-life - Illustrates the most advanced digital tools and methods to support the building design activity, includinggenerative design, virtual reality, and digital fabrication - Presents a thorough review of the most advanced construction materials, building methods, and techniquesfor a new connected and automated construction model - Explores the digital transformation for smart energy buildings and their integration with emerging smartgrids and smart cities - Reflects upon major findings and identifies emerging market opportunities for the whole AECO sector