Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1498754023
Category : Technology & Engineering
Languages : en
Pages : 374
Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Practical Guide to the Packaging of Electronics
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1498754023
Category : Technology & Engineering
Languages : en
Pages : 374
Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Publisher: CRC Press
ISBN: 1498754023
Category : Technology & Engineering
Languages : en
Pages : 374
Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Publications of the National Institute of Standards and Technology ... Catalog
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 1162
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 1162
Book Description
Thermal Testing of Integrated Circuits
Author: J. Altet
Publisher: Springer Science & Business Media
ISBN: 1475736355
Category : Technology & Engineering
Languages : en
Pages : 212
Book Description
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Publisher: Springer Science & Business Media
ISBN: 1475736355
Category : Technology & Engineering
Languages : en
Pages : 212
Book Description
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Thermally-Aware Design
Author: Yong Zhan
Publisher: Now Publishers Inc
ISBN: 1601981708
Category : Integrated circuits
Languages : en
Pages : 131
Book Description
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Publisher: Now Publishers Inc
ISBN: 1601981708
Category : Integrated circuits
Languages : en
Pages : 131
Book Description
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Proceedings of the ... International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816
Book Description
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816
Book Description
Computational Intelligence in Analog and Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design
Author: Mourad Fakhfakh
Publisher: Springer
ISBN: 3319198726
Category : Computers
Languages : en
Pages : 500
Book Description
This book explains the application of recent advances in computational intelligence – algorithms, design methodologies, and synthesis techniques – to the design of integrated circuits and systems. It highlights new biasing and sizing approaches and optimization techniques and their application to the design of high-performance digital, VLSI, radio-frequency, and mixed-signal circuits and systems. This first of two related volumes addresses the design of analog and mixed-signal (AMS) and radio-frequency (RF) circuits, with 17 chapters grouped into parts on analog and mixed-signal applications, and radio-frequency design. It will be of interest to practitioners and researchers in computer science and electronics engineering engaged with the design of electronic circuits.
Publisher: Springer
ISBN: 3319198726
Category : Computers
Languages : en
Pages : 500
Book Description
This book explains the application of recent advances in computational intelligence – algorithms, design methodologies, and synthesis techniques – to the design of integrated circuits and systems. It highlights new biasing and sizing approaches and optimization techniques and their application to the design of high-performance digital, VLSI, radio-frequency, and mixed-signal circuits and systems. This first of two related volumes addresses the design of analog and mixed-signal (AMS) and radio-frequency (RF) circuits, with 17 chapters grouped into parts on analog and mixed-signal applications, and radio-frequency design. It will be of interest to practitioners and researchers in computer science and electronics engineering engaged with the design of electronic circuits.
CRC Handbook of Thermal Engineering
Author: Raj P. Chhabra
Publisher: CRC Press
ISBN: 1351646036
Category : Science
Languages : en
Pages : 1801
Book Description
The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
Publisher: CRC Press
ISBN: 1351646036
Category : Science
Languages : en
Pages : 1801
Book Description
The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
NBS Special Publication
Author:
Publisher:
ISBN:
Category : Physical measurements
Languages : en
Pages : 452
Book Description
Publisher:
ISBN:
Category : Physical measurements
Languages : en
Pages : 452
Book Description
Publications
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 668
Book Description
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 668
Book Description
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 892
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 892
Book Description