Thin Film Materials, Processes, and Reliability PDF Download
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Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 1566775906
Category : Science
Languages : en
Pages : 69
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Book Description
The symposium covered three topics: i) plasma processing for
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 1566775906
Category : Science
Languages : en
Pages : 69
Get Book
Book Description
The symposium covered three topics: i) plasma processing for
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773935
Category : Technology & Engineering
Languages : en
Pages : 438
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Book Description
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773577
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
Author: King-Ning Tu
Publisher: Cambridge University Press
ISBN: 1139492705
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566771832
Category : Technology & Engineering
Languages : en
Pages : 388
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Book Description
Author: Rajendra Singh
Publisher: The Electrochemical Society
ISBN: 9781566772297
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
Author: Milton Ohring
Publisher: Academic Press
ISBN: 9780125249904
Category : Science
Languages : en
Pages : 744
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Book Description
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Author: King-Ning Tu
Publisher: Cambridge University Press
ISBN: 9780521516136
Category : Technology & Engineering
Languages : en
Pages : 412
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Book Description
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Author: Matthew R. Begley
Publisher: Cambridge University Press
ISBN: 1108132731
Category : Science
Languages : en
Pages : 289
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Book Description
A wide variety of applications ranging from microelectronics to turbines for propulsion and power generation rely on films, coatings, and multilayers to improve performance. As such, the ability to predict coating failure - such as delamination (debonding), mud-cracking, blistering, crack kinking, and the like - is critical to component design and development. This work compiles and organizes decades of research that established the theoretical foundation for predicting such failure mechanisms, and clearly outlines the methodology needed to predict performance. Detailed coverage of cracking in multilayers is provided, with an emphasis on the role of differences in thermoelastic properties between the layers. The comprehensive theoretical foundation of the book is complemented by easy-to-use analysis codes designed to empower novices with the tools needed to simulate cracking; these codes enable not only precise quantitative reproduction of results presented graphically in the literature, but also the generation of new results for more complex multilayered systems.
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0125249756
Category : Science
Languages : en
Pages : 817
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Book Description
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
