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Author: Maria Prudenziati
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 498
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Book Description
Inaugurating a new Elsevier series, this volume presents the state of the art in thick-film technology. It disseminates the data identifying the actual performances and applications of thick-film sensors manufactured all over the world, and presents ideas underlying current activities in the research and development of new devices. Three major areas are explored in which thick-film technology contributes as a sensor technology, namely hybrid circuits for signal processing, creation of architectural structures, and transducing elements derived from thick-film pastes. Annotation copyright by Book News, Inc., Portland, OR
Author: Maria Prudenziati
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 498
Get Book Here
Book Description
Inaugurating a new Elsevier series, this volume presents the state of the art in thick-film technology. It disseminates the data identifying the actual performances and applications of thick-film sensors manufactured all over the world, and presents ideas underlying current activities in the research and development of new devices. Three major areas are explored in which thick-film technology contributes as a sensor technology, namely hybrid circuits for signal processing, creation of architectural structures, and transducing elements derived from thick-film pastes. Annotation copyright by Book News, Inc., Portland, OR
Author: W.K. Jones
Publisher: Springer Science & Business Media
ISBN: 9401100799
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Author: Michael S. P. Lucas
Publisher:
ISBN:
Category : Soil moisture
Languages : en
Pages : 68
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Book Description
Author: Marios Sophocleous
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
Author: Robert A. Dorey
Publisher: William Andrew
ISBN: 1437778178
Category : Science
Languages : en
Pages : 217
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Book Description
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc. Provides detailed guidance on the fabrication techniques and applications of thick film MEMS, for engineers and R&D groups Written by a single author, this book provides a clear, coherently written guide to this important emerging technology Covers materials, fabrication and applications in one book
Author: Thomas Papakostas
Publisher:
ISBN:
Category :
Languages : en
Pages : 151
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Book Description
Author: M. Prudenziati
Publisher:
ISBN:
Category :
Languages : it
Pages : 0
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Book Description
Author: Michael I. Panzini
Publisher:
ISBN: 9781614703846
Category : Electronics
Languages : en
Pages : 0
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Book Description
Thick film technology is used to produce electronic devices such as surface mount devices, hybrid integrated circuits and sensors. The manufacture of such devices typically entails the deposition of several successive layers onto an electrically insulating substrate using a screen-printing process. In this book, the authors present topical research in the study of the properties, technology and applications of thick films, including the impact of thick film technology on the development of electrochemical sensors; transport and chemical processes for semiconductor silicon epitaxial film formation; production of thick titanium oxide films by anodic oxidation; the thermo-optical properties of colorless and transparent polyimide nanocomposite films; compatability of thick-film piezo-resistors with different LTCC materials and the three terminal structure for thick microcrystalline Si solar cells.
Author: John Karl Atkinson
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: Jean Laconte
Publisher: Springer Science & Business Media
ISBN: 0387288430
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated. The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology.
