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Author: David C. Larsen
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Author: David C. Larsen
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
Get Book
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Author: Ralph B. Dinwiddie
Publisher: DEStech Publications, Inc
ISBN: 1932078592
Category : Expansion (Heat)
Languages : en
Pages : 858
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Book Description
This book presents the most current research on heat flow in materials, ranging from metals to newer materials such as thin films and nanowires.
Author: Daniel R. Flynn
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 490
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Book Description
Author: David C Larsen
Publisher:
ISBN: 9781468442663
Category :
Languages : en
Pages : 644
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Book Description
Author: Paul H. Sidles
Publisher:
ISBN:
Category : Copper
Languages : en
Pages : 26
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Book Description
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 0387251006
Category : Science
Languages : en
Pages : 285
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Book Description
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Author: Peter S. Gaal
Publisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
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Book Description
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 944
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Book Description
Author: Fran Cverna
Publisher: ASM International
ISBN: 0871707683
Category : Technology & Engineering
Languages : en
Pages : 564
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Book Description
A quick and easy to use source for qualified thermal properties of metals and alloys. The data tables are arranged by material hierarchy, with summary tables sorted by property value. Values are given for a range of high and low temperatures. Short technical discussions at the beginning of each chapter are designed to refresh the reader's understanding of the properties and units covered in that section
Author: C.J. Cremers
Publisher: Springer Science & Business Media
ISBN: 9780306436727
Category : Science
Languages : en
Pages : 740
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Book Description
Fifty-one papers (and three keynote addresses) on contemporary theoretical issues and experimental techniques pertaining to the underlying factors that control heat-conduction behavior of materials. The latest findings on insulation, fluids, and low-dimensional solids and composites are reviewed as