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Author: V. V. Mirkovich
Publisher: Springer Science & Business Media
ISBN: 1461590833
Category : Science
Languages : en
Pages : 477
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Book Description
Once again, it gives me a great pleasure to pen the Foreword to the Proceedings of the 15th International Conference on Thermal Conductivity. As in the past, these now biannual conferences pro vide a broadly based forum for those researchers actively working on this important property of matter to convene on a regular basis to exchange their experiences and report their findings. As it is apparent from the Table of Contents, the 15th Conference represents perhaps the broadest coverage of subject areas to date. This is indicative of the times as the boundaries between disciplines be come increasingly diffused. I am sure the time has come when Con ference Chairmen in coming years will be soliciting contributions not only in the physical sciences and engineering', but will actively seek contributions from the earth sciences and life sciences as well. Indeed, the thermal conductivity and related properties of geological and biological materials are becoming of increasing im portance to our way of life. As it can be seen from the summary table, unfortunately, proceedings have been published only for six of the fifteen con ferences. It is hoped that hereafter this Series will become increasingly well known and be recognized as a major vehicle for the reporting of research on thermal conductivity.
Author: V. V. Mirkovich
Publisher: Springer Science & Business Media
ISBN: 1461590833
Category : Science
Languages : en
Pages : 477
Get Book
Book Description
Once again, it gives me a great pleasure to pen the Foreword to the Proceedings of the 15th International Conference on Thermal Conductivity. As in the past, these now biannual conferences pro vide a broadly based forum for those researchers actively working on this important property of matter to convene on a regular basis to exchange their experiences and report their findings. As it is apparent from the Table of Contents, the 15th Conference represents perhaps the broadest coverage of subject areas to date. This is indicative of the times as the boundaries between disciplines be come increasingly diffused. I am sure the time has come when Con ference Chairmen in coming years will be soliciting contributions not only in the physical sciences and engineering', but will actively seek contributions from the earth sciences and life sciences as well. Indeed, the thermal conductivity and related properties of geological and biological materials are becoming of increasing im portance to our way of life. As it can be seen from the summary table, unfortunately, proceedings have been published only for six of the fifteen con ferences. It is hoped that hereafter this Series will become increasingly well known and be recognized as a major vehicle for the reporting of research on thermal conductivity.
Author: Hsin Wang
Publisher: DEStech Publications, Inc
ISBN: 9781932078343
Category : Science
Languages : en
Pages : 690
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Book Description
In additional to traditional topics such as thermal insulation, instrumentation and standards, the conference highlighted research in carbon nanotubes, nanomaterials, novel thin films, thermoelectric and composites.
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 944
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Book Description
Author: Peter S. Gaal
Publisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
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Book Description
Author: Daniel R. Flynn
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 490
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Book Description
Author: C.J. Cremers
Publisher: Springer Science & Business Media
ISBN: 9780306436727
Category : Science
Languages : en
Pages : 740
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Book Description
Fifty-one papers (and three keynote addresses) on contemporary theoretical issues and experimental techniques pertaining to the underlying factors that control heat-conduction behavior of materials. The latest findings on insulation, fluids, and low-dimensional solids and composites are reviewed as
Author: Timothy W. Tong
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
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Book Description
Author: P. Klemens
Publisher: Springer
ISBN: 148993751X
Category : Technology & Engineering
Languages : en
Pages : 571
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Book Description
It was seven years ago this month when I had the pleasure of writing the Foreword to the Proceedings of the Eighth Conference on Thermal Conductivity hosted by TPRC/ Purdue University in 1968. Since then this Conference has developed to the point where one can say it has just entered a new phase. At its meeting in June 1975, the Board of Governors of the International Thermal Conductivity Conferences passed a resolution which formalizes two main policies that were felt to be desirable for a number of years, A key item of the resolution was for CINDAS/Purdue University to become the permanent Sponsor of the Conferences and in this capacity assist the Conferences in all matters which will result in the effective implementation of its goals and mission. In short, CINDAS will serve as a home base for the Conferences thus providing continuity and a permanent point of contact. CINDAS/Purdue University is pleased to accept this respons ibility as it is well within its mission to promote the advancement and dissemination of knowledge on thermophysica! properties of matter. A second important aspect of the Conference resolution was the establishment of a policy to publish the Proceedings of future conferences on a continuing and uniform basis effective with this, the Fourteenth Conference.
Author: Kenneth E. Wilkes
Publisher: CRC Press
ISBN: 1000448479
Category : Technology & Engineering
Languages : en
Pages : 760
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Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Author: David C. Larsen
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
