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Author: Juan Cepeda-Rizo
Publisher: CRC Press
ISBN: 9781003247005
Category : Technology & Engineering
Languages : en
Pages : 342
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Book Description
"Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"--
Author: Juan Cepeda-Rizo
Publisher: CRC Press
ISBN: 9781003247005
Category : Technology & Engineering
Languages : en
Pages : 342
Get Book Here
Book Description
"Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"--
Author: Juan Cepeda-Rizo
Publisher: CRC Press
ISBN: 1000511073
Category : Technology & Engineering
Languages : en
Pages : 305
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Book Description
Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
Author: Mohammad Noori
Publisher: CRC Press
ISBN: 1000965554
Category : Technology & Engineering
Languages : en
Pages : 358
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Book Description
Data Driven Methods for Civil Structural Health Monitoring and Resilience: Latest Developments and Applications provides a comprehensive overview of data-driven methods for structural health monitoring (SHM) and resilience of civil engineering structures, mostly based on artificial intelligence or other advanced data science techniques. This allows existing structures to be turned into smart structures, thereby allowing them to provide intelligible information about their state of health and performance on a continuous, relatively real-time basis. Artificial-intelligence-based methodologies are becoming increasingly more attractive for civil engineering and SHM applications; machine learning and deep learning methods can be applied and further developed to transform the available data into valuable information for engineers and decision makers.
Author: Homayoon E. Estekanchi
Publisher: CRC Press
ISBN: 1000457648
Category : Technology & Engineering
Languages : en
Pages : 257
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Book Description
The endurance time method (ETM) is a seismic analysis procedure in which intensifying dynamic excitations are used as the loading function, and it provides many unique benefits in the design of structures. It can largely reduce the computational effort needed for the response history analysis of structures. This aids in the practical application of response history-based analysis in problems involving very large models and/or requiring numerous analyses to achieve optimal design goals. A single response history analysis through ETM provides an estimate of the system response at the entire range of seismic intensities of interest, thus making it ideal for applications such as seismic risk assessment, life-cycle cost analysis, and value-based seismic design. Conceptual simplicity also makes ETM a useful tool for preliminary response history analysis of structural systems. Features: Presents full coverage of the subject from basic concepts to advanced applied topics. Provides a coherent text on endurance time excitation functions that are essential in endurance time analysis. Seismic Analysis and Design using the Endurance Time Method serves as a comprehensive resource for students, researchers, and practicing structural engineers who want to familiarize themselves with the concepts and applications of the endurance time method (ETM) as a useful tool for dynamic structural analysis.
Author: Ehsan Noroozinejad Farsangi
Publisher: CRC Press
ISBN: 1000912906
Category : Technology & Engineering
Languages : en
Pages : 639
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Book Description
While the word "automation" may conjure images of robots taking over jobs, the reality is much more nuanced. In construction, for instance, automation is less likely to diminish employment opportunities than it is to increase productivity. Indeed, automation alongside the global need for new and updated infrastructure and better and more affordable housing can help shape the direction of the construction industry. The key will be anticipating and preparing for the shift, in part by developing new skills in the current and future workforce. This book presents all aspects of automation in construction pertaining to the use of information technologies in design, engineering, construction technologies, and maintenance and management of constructed facilities. The broad scope encompasses all stages of the construction life cycle from initial planning and design, through the construction of the facility, its operation, and maintenance, to the eventual dismantling and recycling of buildings and engineering structures. Features: Examines Building Information Management systems, allowing on-site execution of construction more efficient, and for project teams to eliminate mistakes and better coordinate the workforce Presents the latest information on the automation of modular construction, production in factories, including 3-D printing of components such as facades, or even load-bearing and essential components
Author: Qingxue Shang
Publisher: CRC Press
ISBN: 1003837395
Category : Technology & Engineering
Languages : en
Pages : 227
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Book Description
Healthcare facilities or hospital systems are classified as some of the most critical infrastructure systems when responding to natural disasters. Seismic Resilience Assessment of Hospital Infrastructure systematically presents a suite of novel techniques developed by the authors and their team for seismic resilience assessment of hospital infrastructure, with particular emphasis on seismic tests and fragility models of hospital equipment, resilience assessment of single hospital buildings and emergency departments, and post-earthquake functionality of urban hospital infrastructures. Features: Presents a state-of-the-art review on hospital resilience Develops seismic fragility model database for hospital equipment based on shaking table tests Provides a road map for effective and efficient methods necessary for assessing and improving seismic resilience of hospital systems and other critical engineering systems Expertly summarizes outcomes of many important research projects sponsored by various research agencies, including the National Natural Science Foundation of China
Author: E. William Colglazier
Publisher: CRC Press
ISBN: 1000467996
Category : Law
Languages : en
Pages : 394
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Book Description
Environmental sustainability efforts require a great deal of engagement and political will, ranging from local communities to state departments. Science diplomats—from experts and scientists to spokespersons and ambassadors—can help facilitate at all levels and yield valued resources from technology sharing, capacity building, and knowledge exchanges. This book explores the importance of sustained international scientific cooperation, building community resilience, and the role of political will in sustainability and diplomacy. It shows how even small diplomatic efforts can influence myriad issues, from overfishing to human rights negotiations to global carbon emission reduction. Features: • Examines various topics such as global climate change, arid environments, water security and governance, trans-boundary conflict and cooperation, urban and rural resilience, and public health. • Presents case studies from various geographic regions through the lens of diplomacy, including the US–Mexico border, the Gulf of California, South America, Europe, the Middle East, Central and South Asia, and China. • Discusses how building networks of people, organizations, and countries engaged in science diplomacy is crucial for mutual growth and for overcoming conflicting political stances. Sustainable Development for the Americas: Science, Health and Engineering Policy and Diplomacy provides a useful resource for diplomats, policymakers, students, and decision-makers. It provides numerous examples of how using science and technology for policy and diplomacy is essential to finding common ground among nations for a collective global benefit.
Author: John D. Cressler
Publisher: CRC Press
ISBN: 1351832808
Category : Technology & Engineering
Languages : en
Pages : 1044
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Book Description
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Author: Yong Liu
Publisher: Springer Science & Business Media
ISBN: 1461410533
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1030
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Book Description
