Tests of Measurements for Measuring Stress and Strain in Salt PDF Download
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Author: C. K. Quan
Publisher:
ISBN:
Category : Salt industry and trade
Languages : en
Pages : 114
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Author: C. K. Quan
Publisher:
ISBN:
Category : Salt industry and trade
Languages : en
Pages : 114
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Author: John C. Stormont
Publisher:
ISBN:
Category : Halide materials
Languages : en
Pages : 32
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ISBN:
Category : Radioactive waste disposal
Languages : en
Pages : 210
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Author:
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ISBN:
Category : Geology
Languages : en
Pages : 1324
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Author: Richard A. Nelson
Publisher:
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Category : Radioactive waste disposal in the ground
Languages : en
Pages : 224
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Author: Douglas D. Keough
Publisher:
ISBN:
Category : Soil mechanics
Languages : en
Pages : 92
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Eighteen ytterbium piezoresistant sensors in nine Teflon-steel flatpack stress gage-salt core assemblies were fielded in a spherical HE test in a salt medium. The objective was to examine the credibility of in-situ stress measurements by comparing measured stress with stress inferred from independent particle velocity measurements and with stress from computational simulations of the experiment. Criteria for gage emplacement were examined by finite element computational simulation of the emplacement configuration. This simulation indicated that two critical parameters that influence the relationship between free-field stress and the stress in the core at the plane of the stress gage are the bonding of the cores to the native salt and the size of the gage relative to core diameter. Static loading calibration of the stress gages yielded a response essentially the same as static calibrations of ytterbium in uniaxial strain loading. Unloading calibration of the gages showed no hysteresis, unlike the uniaxial strain response of ytterbium foil. A gage sensitivity of .000005 Omega/Omega MPa was found to represent the loading and unloading data and was used to convert the experiment waveforms to stress histories. The experiment produced radial stress histories that are characterized by a slowly rising compression, often containing a precursor of approximately 10 bars (1 MPa), a larger main wave peak of 90 to 350 bars, and a release wave to an apparent tensile stress of 30 to 40 bars.
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Physics
Languages : en
Pages : 298
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Publisher: iSmithers Rapra Publishing
ISBN: 9781859574461
Category : Technology & Engineering
Languages : en
Pages : 168
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Rapra Technology Limited launched its first conference focusing on the bonding of both rubber and plastics to various substrates. The conference aimed to widen the area of discussion from a purely rubber or purely plastic based topic to include those additional related bonding application areas. Papers discussing bonding within the polymer industries and from academic researchers will enable the reader to more fully understand the problems and their solutions for the bonding between polymers and a wide range of substrates. Topics covered at Polymer Bonding 2004 include: latest material advances, new processing technologies, analysis of bonding techniques, progress in application technology, formulation advancement and business and industry issues. List Of Papers...Session 1: Technology Overview; A Review of Recent Developments in Bonding of Steel Products for Rubbers and Plastics Reinforcement Dr Daniel Mauer, N.V. Bekaert S.A. Bonds Factor: Effects from Processing and Chemistry Mr RJ DelVecchio, Technical Consulting Services, USA; Quantum Leap in Polymer Innovation Performance through Advanced Technology Management Dr Wolfram Keller, P R T M, Germany; Session 2: Polymer Bonding Analysis; Can Test Pieces Predict Component Performance? Dr Marina Fernando, Charles Forge & Jonathan Clarke, TARRC, UK; The Development and Exploitation of Accelerated Durability Tests - The; new ASTM D429 Method G immersion Test and Potential Future Developments; Mr Peter Hansen, MERL, UK; Analysis of Adhesion Differences by Nano-Indentation and Cure Kinetics; in a Rubber-Glass Composite Dr Chris Stevens, NGF Europe Ltd, UK; Session 3: Novel Bonding Techniques And Applications; Self-Adhesive Silicone Rubber: High Speed Processing in Conventional; Injection Moulding Dr Sascha Buechel, Wacker-Chemie GmbH, Germany; +++ Paper Unavailable At Time Of Print +++; Bonding Cellulosic Substrates to Polyolefins without Corona treatment; or use of a Primer. Greece; A Shift Toward Two Component Adhesive Packaging that Fits in Standard; Caulking Guns Ms Meghann Horner & Crispin Dean, TAH Europe Inc, UK &; Dan Mottram, TAH Industries, USA; Hybrid Nonisocyanate Polyurethane Adhesives; Prof. Oleg Figovsky, EFM -Enviromentally Friendly Materials GmbH; Germany; Bonding Plastics with Cyanoacrylates and UV Curing Adhesives Mr Bob; Goss, Henkel Loctite Adhesives Ltd, UK; Session 4: Developments In Bonding Technology; Reactive Fluid Bonding Systems; Dr Daniel L Neuman, DuPont Dow Elastomers, USA; Water Based Bonding Agents; Mr Greg Rawlinson & Dr Keith Worthington, Chemical Innovations Limited; (CIL), UK; Aramid as Reinforcement in TPE's: A Method for Measuring Adhesion Ms; Annamarie Zuuring, Teijin Twaron BV, The Netherlands; +++ Paper Unavaiable At Time Of Print +++; Non-Hygroscopic Polyamide Bonding TPV; Mr Synco de Vogel, Solvay Engineered Polymers GmbH, Germany; +++ Paper Unavaiable At Time Of Print +++; Hard-Soft Combinations with Silicone Rubber - Innovative Technical; Solutions Dr Joachim Hegge, & Stefan Rist, GE Bayer Silicone GmbH & Co.; Automotive; Parts Production Mr Aissa Benarous, Chemical Innovations Limited (CIL); UK; Rapra Technology 2004
Author: Tom W. Pfeifle
Publisher:
ISBN:
Category : Hazardous waste sites
Languages : en
Pages : 248
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Author:
Publisher:
ISBN:
Category : Geophysics
Languages : en
Pages : 876
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