Author: Vernon R. Miller
Publisher:
ISBN:
Category : Solder and soldering
Languages : en
Pages : 36
Book Description
Tests for Tin-lead Solders and Solder Joints
Author: Vernon R. Miller
Publisher:
ISBN:
Category : Solder and soldering
Languages : en
Pages : 36
Book Description
Publisher:
ISBN:
Category : Solder and soldering
Languages : en
Pages : 36
Book Description
Strength of Soft-soldered Joints in Copper Tubing
Author: Arthur R. Maupin
Publisher:
ISBN:
Category : Joints (Engineering)
Languages : en
Pages : 32
Book Description
Publisher:
ISBN:
Category : Joints (Engineering)
Languages : en
Pages : 32
Book Description
Solder Joint Reliability
Author: John H. Lau
Publisher: Springer Science & Business Media
ISBN: 1461539102
Category : Technology & Engineering
Languages : en
Pages : 649
Book Description
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Publisher: Springer Science & Business Media
ISBN: 1461539102
Category : Technology & Engineering
Languages : en
Pages : 649
Book Description
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Building Materials and Structures Report
Author:
Publisher:
ISBN:
Category : Building materials
Languages : en
Pages : 1390
Book Description
Publisher:
ISBN:
Category : Building materials
Languages : en
Pages : 1390
Book Description
Development of a Soft-soldering System for Aluminum
Author: Wilbert L. Falke
Publisher:
ISBN:
Category : Aluminum
Languages : en
Pages : 24
Book Description
Publisher:
ISBN:
Category : Aluminum
Languages : en
Pages : 24
Book Description
Report of Investigations
Author:
Publisher:
ISBN:
Category : Mineral industries
Languages : en
Pages : 702
Book Description
Publisher:
ISBN:
Category : Mineral industries
Languages : en
Pages : 702
Book Description
Bromide and Iodide in Oilfield Brines in Some Tertiary and Cretaceous Formations in Mississippi and Alabama
Author: A. Gene Collins
Publisher:
ISBN:
Category : Oil field brines
Languages : en
Pages : 526
Book Description
Publisher:
ISBN:
Category : Oil field brines
Languages : en
Pages : 526
Book Description
Symposium on Solder
Author:
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 197
Book Description
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 197
Book Description
Journal of Research of the National Bureau of Standards
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 946
Book Description
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 946
Book Description
Metal Worker, Plumber and Steam Fitter
Author:
Publisher:
ISBN:
Category : Heating
Languages : en
Pages : 1286
Book Description
Publisher:
ISBN:
Category : Heating
Languages : en
Pages : 1286
Book Description