Symposium on Solder PDF Download
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Author:
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 197
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Book Description
Author:
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 197
Get Book Here
Book Description
Author: American Society for Testing Materials
Publisher:
ISBN:
Category : Solder and soldering
Languages : en
Pages : 200
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Book Description
Author:
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 117
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Book Description
Author: ASM International
Publisher: ASM International
ISBN: 1615030913
Category : Electronic apparatus and appliances
Languages : en
Pages : 551
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Book Description
Author: Baoyan Duan
Publisher: Springer Nature
ISBN: 9811913099
Category : Technology & Engineering
Languages : en
Pages : 2195
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Book Description
The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Author: KV Subramanian
Publisher: Springer Science & Business Media
ISBN: 0387484337
Category : Technology & Engineering
Languages : en
Pages : 370
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Book Description
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Author: Mohd Arif Anuar Mohd Salleh
Publisher: Springer Nature
ISBN: 9811992673
Category : Science
Languages : en
Pages : 873
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Book Description
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Author: Ephraim Suhir
Publisher: CRC Press
ISBN: 0429863829
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Author: G.Q. Zhang
Publisher: Springer Science & Business Media
ISBN: 1402049358
Category : Technology & Engineering
Languages : en
Pages : 580
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Book Description
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Author: Mel Schwartz
Publisher: ASM International
ISBN: 1627080589
Category : Technology & Engineering
Languages : en
Pages : 207
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Book Description
Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
