Substrate Noise Coupling in Mixed-Signal ASICs PDF Download
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Author: Stéphane Donnay
Publisher: Springer Science & Business Media
ISBN: 0306481707
Category : Technology & Engineering
Languages : en
Pages : 311
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Book Description
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Author: Stéphane Donnay
Publisher: Springer Science & Business Media
ISBN: 0306481707
Category : Technology & Engineering
Languages : en
Pages : 311
Get Book Here
Book Description
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Author: Nawej Mwez
Publisher:
ISBN:
Category : Electronic noise
Languages : en
Pages : 234
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Book Description
Author: X. Aragones
Publisher: Springer Science & Business Media
ISBN: 1475730136
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Author: Cole Erwin Zemke
Publisher:
ISBN:
Category :
Languages : en
Pages : 76
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Book Description
Author: Hongmei Li
Publisher:
ISBN:
Category :
Languages : en
Pages : 76
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Book Description
Author: Hai Lan
Publisher:
ISBN:
Category :
Languages : en
Pages : 142
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Book Description
Author: Thomas Noulis
Publisher: CRC Press
ISBN: 1138031615
Category : Technology & Engineering
Languages : en
Pages : 519
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Book Description
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Author: Simon Kristiansson
Publisher:
ISBN: 9789173850049
Category :
Languages : en
Pages : 120
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 148
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Book Description
Author: Elie M. Issa
Publisher:
ISBN:
Category : Mixed signal circuits
Languages : en
Pages : 98
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Book Description
"Integrating digital with sensitive analog circuitry has created concerns for signal integrity. The fast switching digital signal creates noise that injects through the doped silicon substrate abd travels through it, due to its low resistivity to the analog circuits causing damages and operational bandwidth reduction. How much is the coupling and how to control it? These are the questions that will be answered in this thesis using 3D filed solver, COMSOL, to extract the substrate coupling parameters." (v)
