Structural Analysis in Microelectronics and Fiber Optics, 1996 PDF Download
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Author: Ephraim Suhir
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 236
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Book Description
Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses
Author: Ephraim Suhir
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 236
Get Book Here
Book Description
Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses
Author:
Publisher:
ISBN:
Category : Fiber optics
Languages : en
Pages : 294
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Book Description
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: National Semiconductor Metrology Program (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 120
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Book Description
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 160
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 148
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Book Description
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 9401165351
Category : Science
Languages : en
Pages : 429
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Book Description
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
Author: Ephraim Suhir
Publisher: CRC Press
ISBN: 0429863829
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 160
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Book Description
Author: Ephraim Suhir
Publisher: John Wiley & Sons
ISBN: 047088679X
Category : Technology & Engineering
Languages : en
Pages : 610
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Book Description
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
