Specification for Electroless Nickel/immersion Gold (ENIG) Plating for Printed Circuit Boards PDF Download
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Author:
Publisher:
ISBN:
Category : Printed circuits
Languages : en
Pages : 25
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Book Description
Author:
Publisher:
ISBN:
Category : Printed circuits
Languages : en
Pages : 25
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Book Description
Author: IPC (Organization)
Publisher:
ISBN: 9781611930764
Category : Electroless plating
Languages : en
Pages : 26
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Book Description
"This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM)."--P. 1.
Author: Ipc
Publisher:
ISBN: 9781638160151
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN:
Category : Electroless plating
Languages : en
Pages : 140
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Book Description
Author:
Publisher:
ISBN: 9781611930818
Category :
Languages : en
Pages :
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Author: IPC International
Publisher:
ISBN: 9781638160502
Category :
Languages : en
Pages :
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Book Description
Author: R. Winston Revie
Publisher: John Wiley & Sons
ISBN: 0470080329
Category : Technology & Engineering
Languages : en
Pages : 1299
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Book Description
This book serves as a reference for engineers, scientists, and students concerned with the use of materials in applications where reliability and resistance to corrosion are important. It updates the coverage of its predecessor, including coverage of: corrosion rates of steel in major river systems and atmospheric corrosion rates, the corrosion behavior of materials such as weathering steels and newer stainless alloys, and the corrosion behavior and engineering approaches to corrosion control for nonmetallic materials. New chapters include: high-temperature oxidation of metals and alloys, nanomaterials, and dental materials, anodic protection. Also featured are chapters dealing with standards for corrosion testing, microbiological corrosion, and electrochemical noise.
Author: Edwin Bradley
Publisher: John Wiley & Sons
ISBN: 9780470171462
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Author: Jasbir Bath
Publisher: Springer Science & Business Media
ISBN: 0387684220
Category : Technology & Engineering
Languages : en
Pages : 307
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Book Description
The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.
Author: Jasbir Bath
Publisher: John Wiley & Sons
ISBN: 1119481937
Category : Technology & Engineering
Languages : en
Pages : 512
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Book Description
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
