Silicon Materials Science and Technology PDF Download
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Author: Howard R. Huff
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 894
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Book Description
Author: Howard R. Huff
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 894
Get Book
Book Description
Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 800
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Book Description
Author: Howard R. Huff
Publisher:
ISBN: 9781566771931
Category : Technology & Engineering
Languages : en
Pages : 800
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Book Description
Author: Howard R. Huff
Publisher: The Electrochemical Society
ISBN: 156677439X
Category : Semiconductors
Languages : en
Pages : 599
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Book Description
This was the tenth symposium of the International Symposium on Silcon Material Science and Technology, going back to 1969. This issue provides a unique historical record of the program and will aid in the understanding of silicon materials over the last 35 years.
Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 800
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Book Description
Author: Howard R. Huff
Publisher: The Electrochemical Society
ISBN: 9781566771931
Category : Technology & Engineering
Languages : en
Pages : 894
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Book Description
Author: G. Harbeke
Publisher:
ISBN:
Category :
Languages : en
Pages : 345
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Book Description
Author: Howard R. Huff
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: Günther Harbeke
Publisher: Springer
ISBN: 9783642747236
Category : Science
Languages : en
Pages : 0
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Book Description
The summer school on "Silicon: Materials Science and Technology" was held at the Ettore Majorana Centre for Scientific Culture in Erice, Sicily. It was the 16th course of a series in the International School of Materials Science and Technology. The course attracted participants from all over the world. 30 lectures were presented by internationally reputed experts in the field. The proceedings include all the lecture topics of the course. Short notes on the scientific work of the attendees are integrated with the main papers. The semiconductor material silicon is of paramount importance in micro electronics. The various aspects of the silicon materials science and its technol ogy were critically reviewed and the forseeable future developments of devices and integrated circuits were discussed during the two weeks of the course. The topics ranged from the fundamental physics to the applied science of processing technology and device fabrication covering crystal growth, processing technol ogy, defects, measurement methods, thin films, and device problems. The course brought together theoretical and experimental physicists and engineers from universities, research institutes and industry. The unique setting of the Ettore Majorana Centre in the ancient town of Erice created a friendly atmosphere for fruitful scientific exchange. Long dis cussions continued over lunch and only ended late at night in the wine cellar of the school.
Author: Markku Tilli
Publisher: Elsevier
ISBN: 012817787X
Category : Technology & Engineering
Languages : en
Pages : 1028
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Book Description
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
