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Author:
Publisher: Pearson Education South Asia
ISBN: 9789812478504
Category : Physics
Languages : en
Pages : 124
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Book Description
Author:
Publisher: Pearson Education South Asia
ISBN: 9789812478504
Category : Physics
Languages : en
Pages : 124
Get Book Here
Book Description
Author: Loo & Loo
Publisher: Pearson Education South Asia
ISBN: 9789810603229
Category : Physics
Languages : en
Pages : 114
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Book Description
Author: IGCP Project 259
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 136
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Book Description
This book stems from the multi-stage International Geochemical Mapping (IGM), an International Geological Correlation Programme (IGCP) project, to set up a global geochemical database on the distribution and quantities present of all 92 chemical elements in the surface of the earth. A comprehensive review and evaluation of methods for regional and national geochemical mapping and providing a recognized, global quantitative base on which local investigations can be built for particular environmental and economic problems concerning various aspects of land use.
Author: Andrea Bonarini
Publisher: Springer Science & Business Media
ISBN: 3790817686
Category : Computers
Languages : en
Pages : 231
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Book Description
The papers collected in this book are concerned with the application of the so-called "soft-computing" techniques to the aim of defining flexible systems. The topics covered witness the actual research trend towards an integration of distinct formal techniques for defining flexible systems. The contributions in this volume mainly concern the definition of systems in several application fields, such as image processing, control, asset allocation, medicine, time series forecasting, qualitative modeling, support to design, reliability analysis, diagnosis, filtering, data analysis, land mines detection and so forth. The papers presented in this volume are organized into three main thematic sections: Fuzzy Systems, Neural Networks and Genetic and Evolutionary Algorithms, although, as outlined before, some works employ more than one technique from these fields.
Author: Navnit Shah
Publisher: Springer
ISBN: 1493915983
Category : Medical
Languages : en
Pages : 702
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Book Description
This volume offers a comprehensive guide on the theory and practice of amorphous solid dispersions (ASD) for handling challenges associated with poorly soluble drugs. In twenty-three inclusive chapters, the book examines thermodynamics and kinetics of the amorphous state and amorphous solid dispersions, ASD technologies, excipients for stabilizing amorphous solid dispersions such as polymers, and ASD manufacturing technologies, including spray drying, hot melt extrusion, fluid bed layering and solvent-controlled micro-precipitation technology (MBP). Each technology is illustrated by specific case studies. In addition, dedicated sections cover analytical tools and technologies for characterization of amorphous solid dispersions, the prediction of long-term stability, and the development of suitable dissolution methods and regulatory aspects. The book also highlights future technologies on the horizon, such as supercritical fluid processing, mesoporous silica, KinetiSol®, and the use of non-salt-forming organic acids and amino acids for the stabilization of amorphous systems. Amorphous Solid Dispersions: Theory and Practice is a valuable reference to pharmaceutical scientists interested in developing bioavailable and therapeutically effective formulations of poorly soluble molecules in order to advance these technologies and develop better medicines for the future.
Author: Joachim Burghartz
Publisher: Springer Science & Business Media
ISBN: 1441972765
Category : Technology & Engineering
Languages : en
Pages : 471
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Book Description
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 1482274663
Category : Technology & Engineering
Languages : en
Pages : 1983
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Book Description
Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences, and includes sections on solid-state physics, quantum mechanics, crystallography, and fluidics. The second volume presents a very large set of manufacturing techniques for micro- and nanofabrication and covers different forms of lithography, material removal processes, and additive technologies. The third volume focuses on manufacturing techniques and applications of Bio-MEMS and Bio-NEMS. Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems. The author characterizes and defines major research areas and illustrates them with examples pulled from the most recent literature and from his own work.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
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Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author: North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development
Publisher:
ISBN: 9789283600046
Category : Aeronautics
Languages : en
Pages :
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Book Description
