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Author: Ayan Karmakar
Publisher: Springer
ISBN: 9811380511
Category : Technology & Engineering
Languages : en
Pages : 144
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Book Description
This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
Author: Ayan Karmakar
Publisher: Springer
ISBN: 9811380511
Category : Technology & Engineering
Languages : en
Pages : 144
Get Book
Book Description
This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
Author: Ayan Karmakar
Publisher:
ISBN: 9789811380525
Category : Radio frequency integrated circuits
Languages : en
Pages : 157
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Book Description
This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
Author: Ali M. Niknejad
Publisher: Springer Science & Business Media
ISBN: 0387765611
Category : Technology & Engineering
Languages : en
Pages : 313
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Book Description
This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.
Author: Tatsuo Itoh
Publisher: John Wiley & Sons
ISBN: 0471463922
Category : Technology & Engineering
Languages : en
Pages : 482
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Book Description
A survey of microwave technology tailored for professionals in wireless communications RF Technologies for Low Power Wireless Communications updates recent developments in wireless communications from a hardware design standpoint and offers specialized coverage of microwave technology with a focus on the low power wireless units required in modern wireless systems. It explores results of recent research that focused on a holistic, integrated approach to the topics of materials, devices, circuits, modulation, and architectures rather than the more traditional approach of research into isolated topical areas. Twelve chapters deal with various fundamental research aspects of low power wireless electronics written by world-class experts in each field. The first chapter offers an overview of wireless architecture and performance, followed by detailed coverage of: Advanced GaAs-based HBT designs InP-based devices and circuits Si/SiGe HBT technology Noise in GaN devices Power amplifier architectures and nonlinearities Planar-oriented components MEMS and micromachined components Resonators, filters, and low-noise oscillators Antennas Transceiver front-end architectures With a clear focus and expert contributors, RF Technologies for Low Power Wireless Communications will be of interest to a wide range of electrical engineering disciplines working in wireless technologies.
Author: Shenglin Ma
Publisher: Elsevier
ISBN: 0323996035
Category : Technology & Engineering
Languages : en
Pages : 294
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Book Description
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology
Author: Ghenadii Korotcenkov
Publisher: CRC Press
ISBN: 1482264595
Category : Science
Languages : en
Pages : 431
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Book Description
Porous silicon is rapidly attracting increasing interest from various fields, including optoelectronics, microelectronics, photonics, medicine, sensor and energy technologies, chemistry, and biosensing. This nanostructured and biodegradable material has a range of unique properties that make it ideal for many applications. This book, the third of a
Author: Vadim Issakov
Publisher: Springer Science & Business Media
ISBN: 3642135986
Category : Technology & Engineering
Languages : en
Pages : 218
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Book Description
There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.
Author: Cam Nguyen
Publisher: John Wiley & Sons
ISBN: 1118900472
Category : Technology & Engineering
Languages : en
Pages : 888
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Book Description
Radio-Frequency Integrated-Circuit Engineering addressesthe theory, analysis and design of passive and active RFIC's usingSi-based CMOS and Bi-CMOS technologies, and other non-silicon basedtechnologies. The materials covered are self-contained andpresented in such detail that allows readers with onlyundergraduate electrical engineering knowledge in EM, RF, andcircuits to understand and design RFICs. Organized into sixteenchapters, blending analog and microwave engineering,Radio-Frequency Integrated-Circuit Engineering emphasizesthe microwave engineering approach for RFICs. • Provides essential knowledge in EM and microwaveengineering, passive and active RFICs, RFIC analysis and designtechniques, and RF systems vital for RFIC students andengineers • Blends analog and microwave engineering approaches forRFIC design at high frequencies • Includes problems at the end of each chapter
Author: Jeffrey L. Hilbert
Publisher: CRC Press
ISBN: 1498718922
Category : Technology & Engineering
Languages : en
Pages : 330
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Book Description
An Industry Perspective on Key Tunable Technologies and Applications Tunable RF Components and Circuits: Applications in Mobile Handsets provides a technical introduction to the state of the art in tunable radio frequency (RF) components, circuits, and applications and discusses the foundational work that has been done to date. Leading practitioners in the field share their expertise on tunable devices in mobile handset applications. Through these practical viewpoints, readers discover how to use tunable RF techniques and devices to develop successful product designs. A substantial portion of the book focuses on antennas and antenna tuning, reflecting the dominance of the antenna tuning application in today’s commercial market for tunable RF. The book explains how RF-microelectromechanical systems (RF-MEMS), barium strontium titinate (BST), silicon-on-insulator (SOI) field effect transistors (FETs), and high-performance complementary metal oxide semiconductors (CMOS) are used as enabling technologies for tunable functions in current and next-generation radio architectures. The book also describes power amplifier envelope tracking, an emerging and important technique for improving efficiency; presents a network operator’s perspective on the evolution of the handset front end; and explores emerging approaches to production testing of wireless devices.
Author: Vittorio Camarchia
Publisher: Artech House
ISBN: 1630810169
Category : Technology & Engineering
Languages : en
Pages : 370
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Book Description
This timely new resource presents an overview of the electronics of mobile network backhaul. Infrastructure planning, architecture evolution, digital controls, and countermeasures are all presented highlighting the building blocks of specific backhaul features. Tx and Rx design and antenna requirements and covered while examining the overall construction of the microwave radio hardware blocks. Single blocks are explored: the antenna, the analog transmitter and receiver, and the modem, recalling the most important aspects of transport networks and microwave link dimensioning. Essential theory is provided for each hardware block with an emphasis on present solutions. Authored by academic and industrial experts in the field, development and design engineers will benefit from the practical guidance in solving realistic issues and providing useful tips throughout the design process. This book guides readers through the historical evolution of microwave radios and the components of the next generation of mobile networks.
