Semiconductor Wafer Bonding : Science, Technology, and Applications V PDF Download
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Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Author: C. S. Tan
Publisher: The Electrochemical Society
ISBN: 1607688514
Category : Science
Languages : en
Pages : 258
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Book Description
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Author: International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, Hawaii
Publisher:
ISBN: 9781566770682
Category : Technology & Engineering
Languages : en
Pages : 485
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774604
Category : Microelectromechanical systems
Languages : en
Pages : 476
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Book Description
Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
Author: Helmut Baumgart
Publisher: The Electrochemical Society
ISBN: 156677506X
Category : Microelectromechanical systems
Languages : en
Pages : 398
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Book Description
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author: H. Baumgart
Publisher: The Electrochemical Society
ISBN: 9781566773607
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 1566776546
Category : Microelectromechanical systems
Languages : en
Pages : 588
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Book Description
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
