Semiconductor Wafer Bonding: Science, Technology, and Applications 15 PDF Download
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Author: C. S. Tan
Publisher: The Electrochemical Society
ISBN: 1607688514
Category : Science
Languages : en
Pages : 258
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Book Description
Author: C. S. Tan
Publisher: The Electrochemical Society
ISBN: 1607688514
Category : Science
Languages : en
Pages : 258
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Book Description
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774604
Category : Microelectromechanical systems
Languages : en
Pages : 476
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Book Description
Author: C. Colinge
Publisher: The Electrochemical Society
ISBN: 1566778239
Category : Science
Languages : en
Pages : 656
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Book Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author:
Publisher: The Electrochemical Society
ISBN: 1566776546
Category : Microelectromechanical systems
Languages : en
Pages : 588
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Book Description
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author: Chuan Seng Tan
Publisher:
ISBN: 9781510871656
Category :
Languages : en
Pages : 248
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Book Description
Author: Helmut Baumgart
Publisher: The Electrochemical Society
ISBN: 156677506X
Category : Microelectromechanical systems
Languages : en
Pages : 398
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Book Description
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author: Markku Tilli
Publisher: William Andrew
ISBN: 0323312233
Category : Technology & Engineering
Languages : en
Pages : 827
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Book Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524
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Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
