Selected Papers from the 9th Symposium on Micro-Nano Science and Technology on Micromachines PDF Download
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Author: Koji Miyazaki
Publisher:
ISBN: 9783039216970
Category : Electronic books
Languages : en
Pages : 1
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Book Description
This Special Issue presents selected papers from the 8th Symposium on Micro-Nano Science and Technology on Micromachines, 31 October-2 November, 2017, in Hiroshima, Japan. We encouraged contributions of significant and original works in order to deeply understand physical, chemical, and biological phenomena at the micro/nano scale and to develop applied technologies. The conference covered the following main topics: 1: Precision machinery lubrication design 2: Material dynamics strength 3: Hydrodynamics 4: Thermal engineering 5: Production processing mechanical materials 6: Robotics mechatronics 7: Medical biotechnology 8: Micro/nano system The papers that attracted the most interest at the conference, or that provided novel contributions, were selected for publication in Micromachines. These papers were peer-reviewed for validation of the research results, developments and applications.
Author: Koji Miyazaki
Publisher:
ISBN: 9783039216970
Category : Electronic books
Languages : en
Pages : 1
Get Book Here
Book Description
This Special Issue presents selected papers from the 8th Symposium on Micro-Nano Science and Technology on Micromachines, 31 October-2 November, 2017, in Hiroshima, Japan. We encouraged contributions of significant and original works in order to deeply understand physical, chemical, and biological phenomena at the micro/nano scale and to develop applied technologies. The conference covered the following main topics: 1: Precision machinery lubrication design 2: Material dynamics strength 3: Hydrodynamics 4: Thermal engineering 5: Production processing mechanical materials 6: Robotics mechatronics 7: Medical biotechnology 8: Micro/nano system The papers that attracted the most interest at the conference, or that provided novel contributions, were selected for publication in Micromachines. These papers were peer-reviewed for validation of the research results, developments and applications.
Author: Norihisa Miki
Publisher: MDPI
ISBN: 3038977284
Category : Science
Languages : en
Pages : 154
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Book Description
This Special Issue presents selected papers from the 8th Symposium on Micro–Nano Science and Technology on Micromachines, 31 October–2 November, 2017, in Hiroshima, Japan. We encouraged contributions of significant and original works in order to deeply understand physical, chemical, and biological phenomena at the micro/nano scale and to develop applied technologies. The conference covered the following main topics: 1: Precision machinery lubrication design 2: Material dynamics strength 3: Hydrodynamics 4: Thermal engineering 5: Production processing mechanical materials 6: Robotics mechatronics 7: Medical biotechnology 8: Micro/nano system The papers that attracted the most interest at the conference, or that provided novel contributions, were selected for publication in Micromachines. These papers were peer-reviewed for validation of the research results, developments and applications.
Author: Koji Miyazaki
Publisher: MDPI
ISBN: 3039216961
Category : Technology & Engineering
Languages : en
Pages : 170
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Book Description
This Special Issue presents selected papers from the 8th Symposium on Micro–Nano Science and Technology on Micromachines, 31 October–2 November, 2017, in Hiroshima, Japan. We encouraged contributions of significant and original works in order to deeply understand physical, chemical, and biological phenomena at the micro/nano scale and to develop applied technologies. The conference covered the following main topics: 1: Precision machinery lubrication design 2: Material dynamics strength 3: Hydrodynamics 4: Thermal engineering 5: Production processing mechanical materials 6: Robotics mechatronics 7: Medical biotechnology 8: Micro/nano system The papers that attracted the most interest at the conference, or that provided novel contributions, were selected for publication in Micromachines. These papers were peer-reviewed for validation of the research results, developments and applications.
Author: Koji Miyazaki
Publisher:
ISBN: 9783038977292
Category : Electronic books
Languages : en
Pages : 1
Get Book Here
Book Description
This Special Issue presents selected papers from the 8th Symposium on Micro-Nano Science and Technology on Micromachines, 31 October-2 November, 2017, in Hiroshima, Japan. We encouraged contributions of significant and original works in order to deeply understand physical, chemical, and biological phenomena at the micro/nano scale and to develop applied technologies. The conference covered the following main topics: 1: Precision machinery lubrication design 2: Material dynamics strength 3: Hydrodynamics 4: Thermal engineering 5: Production processing mechanical materials 6: Robotics mechatronics 7: Medical biotechnology 8: Micro/nano system The papers that attracted the most interest at the conference, or that provided novel contributions, were selected for publication in Micromachines. These papers were peer-reviewed for validation of the research results, developments and applications.
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 696
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Book Description
Author: R. K. Nagaria
Publisher: Springer Nature
ISBN: 9819909732
Category : Technology & Engineering
Languages : en
Pages : 867
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Book Description
This book covers a variety of topics in Electronics and Communication Engineering, especially in the area of microelectronics and VLSI design, communication systems and networks, and signal and image processing. The content is based on papers presented at the 5th International Conference on VLSI, Communication and Signal Processing (VCAS 2022). The book also discusses the emerging applications of novel tools and techniques in image, video, and multimedia signal processing. This book is useful to students, researchers, and professionals working in the electronics and communication domain.
Author: Reza Ghodssi
Publisher: Springer Science & Business Media
ISBN: 0387473181
Category : Technology & Engineering
Languages : en
Pages : 1211
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Book Description
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Author: M. S. Shunmugam
Publisher: Springer Nature
ISBN: 9813294256
Category : Technology & Engineering
Languages : en
Pages : 720
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Book Description
This volume presents research papers on micro and nano manufacturing and surface engineering which were presented during the 7th International and 28th All India Manufacturing Technology, Design and Research conference 2018 (AIMTDR 2018). The papers discuss the latest advances in miniature manufacturing, the machining of miniature components and features as well as improvement of surface properties. This volume will be of interest to academicians, researchers, and practicing engineers alike.
Author: Tullio Tolio
Publisher: Springer
ISBN: 3319943588
Category : Technology & Engineering
Languages : en
Pages : 490
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Book Description
This book is open access under a CC BY 4.0 license.This book presents results relevant in the manufacturing research field, that are mainly aimed at closing the gap between the academic investigation and the industrial application, in collaboration with manufacturing companies. Several hardware and software prototypes represent the key outcome of the scientific contributions that can be grouped into five main areas, representing different perspectives of the factory domain:1) Evolutionary and reconfigurable factories to cope with dynamic production contexts characterized by evolving demand and technologies, products and processes.2) Factories for sustainable production, asking for energy efficiency, low environmental impact products and processes, new de-production logics, sustainable logistics.3) Factories for the People who need new kinds of interactions between production processes, machines, and human beings to offer a more comfortable and stimulating working environment.4) Factories for customized products that will be more and more tailored to the final user’s needs and sold at cost-effective prices.5) High performance factories to yield the due production while minimizing the inefficiencies caused by failures, management problems, maintenance.This books is primarily targeted to academic researchers and industrial practitioners in the manufacturing domain.
Author: Yung-cheng Lee
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
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Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
