Author: Kazuo Kondo
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Morphological Evolution of Electrodeposits and Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors IV
Author: Kazuo Kondo
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Meeting Abstracts
Author: Electrochemical Society. Meeting
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 1172
Book Description
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 1172
Book Description
Atomic Layer Deposition for Semiconductors
Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Transition Metal Carbides and Nitrides
Author: Louis Toth
Publisher: Elsevier
ISBN: 032315722X
Category : Technology & Engineering
Languages : en
Pages : 296
Book Description
Refractory Materials, Volume 7: Transition Metal Carbides and Nitrides discusses the developments in transition metal carbide and nitride research. This volume is organized into nine chapters that emphasize the mechanical and superconducting properties of these compounds. The introductory chapters deal with the general properties, preparation techniques, characterization, crystal chemistry, phase relationships, and thermodynamics of transition metal carbides and nitrides. The following chapter highlights the mechanical properties of these compounds, such as elastic and plastic deformation, fracture, strengthening mechanisms, and hardness. The discussion then shifts to specific electrical and magnetic properties, including electrical resistivity, Hall coefficient, and magnetic susceptibility. A separate chapter is devoted to carbides and nitrides as superconductors. The concluding chapters explore certain theories that explain the mechanisms of band structure and bonding in carbides and nitrides. This volume is of great value to research workers in metallurgy, ceramics, physics, chemistry, and related fields, as well as to advanced students investigating problems concerning high temperature materials or interstitial compounds.
Publisher: Elsevier
ISBN: 032315722X
Category : Technology & Engineering
Languages : en
Pages : 296
Book Description
Refractory Materials, Volume 7: Transition Metal Carbides and Nitrides discusses the developments in transition metal carbide and nitride research. This volume is organized into nine chapters that emphasize the mechanical and superconducting properties of these compounds. The introductory chapters deal with the general properties, preparation techniques, characterization, crystal chemistry, phase relationships, and thermodynamics of transition metal carbides and nitrides. The following chapter highlights the mechanical properties of these compounds, such as elastic and plastic deformation, fracture, strengthening mechanisms, and hardness. The discussion then shifts to specific electrical and magnetic properties, including electrical resistivity, Hall coefficient, and magnetic susceptibility. A separate chapter is devoted to carbides and nitrides as superconductors. The concluding chapters explore certain theories that explain the mechanisms of band structure and bonding in carbides and nitrides. This volume is of great value to research workers in metallurgy, ceramics, physics, chemistry, and related fields, as well as to advanced students investigating problems concerning high temperature materials or interstitial compounds.
Waste Energy Harvesting
Author: Ling Bing Kong
Publisher: Springer Science & Business Media
ISBN: 364254634X
Category : Technology & Engineering
Languages : en
Pages : 603
Book Description
Waste Energy Harvesting overviews the latest progress in waste energy harvesting technologies, with specific focusing on waste thermal mechanical energies. Thermal energy harvesting technologies include thermoelectric effect, storage through phase change materials and pyroelectric effect. Waste mechanical energy harvesting technologies include piezoelectric (ferroelectric) effect with ferroelectric materials and nanogenerators. The book aims to strengthen the syllabus in energy, materials and physics and is well suitable for students and professionals in the fields.
Publisher: Springer Science & Business Media
ISBN: 364254634X
Category : Technology & Engineering
Languages : en
Pages : 603
Book Description
Waste Energy Harvesting overviews the latest progress in waste energy harvesting technologies, with specific focusing on waste thermal mechanical energies. Thermal energy harvesting technologies include thermoelectric effect, storage through phase change materials and pyroelectric effect. Waste mechanical energy harvesting technologies include piezoelectric (ferroelectric) effect with ferroelectric materials and nanogenerators. The book aims to strengthen the syllabus in energy, materials and physics and is well suitable for students and professionals in the fields.
Physics of Electronic Conduction in Solids
Author: Frank J. Blatt
Publisher:
ISBN:
Category : Electric conductivity
Languages : en
Pages : 472
Book Description
Classification of solids -- Lattice vibrations and lattice specific heat -- Equilibrium properties of a free-electron gas -- Electrons in a periodic lattice -- Transport equation -- Relaxation mechanisms -- Conductivity and related phenomena : metals -- Homogeneous semiconductors -- Rectifying junctions and transistors -- Optical properties of semiconductors -- Properties of semiconductors and metals in strong magnetic fields -- Appendix A. Summary of Elementary Quantum Mechanics -- Appendix B. Units and Conversion factors -- Appendix C. The Periodic Table -- Appendix D. Values of Important Physical Constants and Some Convenient Conversion Factors -- Appendix E. List of Symbols.
Publisher:
ISBN:
Category : Electric conductivity
Languages : en
Pages : 472
Book Description
Classification of solids -- Lattice vibrations and lattice specific heat -- Equilibrium properties of a free-electron gas -- Electrons in a periodic lattice -- Transport equation -- Relaxation mechanisms -- Conductivity and related phenomena : metals -- Homogeneous semiconductors -- Rectifying junctions and transistors -- Optical properties of semiconductors -- Properties of semiconductors and metals in strong magnetic fields -- Appendix A. Summary of Elementary Quantum Mechanics -- Appendix B. Units and Conversion factors -- Appendix C. The Periodic Table -- Appendix D. Values of Important Physical Constants and Some Convenient Conversion Factors -- Appendix E. List of Symbols.
Nanocomposite Materials
Author: Jyotishkumar Parameswaranpillai
Publisher: CRC Press
ISBN: 1315355078
Category : Science
Languages : en
Pages : 505
Book Description
This book provides a comprehensive collection of the latest information on nanomaterials and nanocomposites. It covers material synthesis, processing, structure characterization, properties and applications. It presents a coherent treatment of how composite properties depend on nanostructure, and covers cutting-edge topics like bionanocomposites for sustainable development. This book summarizes many developments in the field making it an ideal resource for researchers from industry, academia, government and private research institutions.
Publisher: CRC Press
ISBN: 1315355078
Category : Science
Languages : en
Pages : 505
Book Description
This book provides a comprehensive collection of the latest information on nanomaterials and nanocomposites. It covers material synthesis, processing, structure characterization, properties and applications. It presents a coherent treatment of how composite properties depend on nanostructure, and covers cutting-edge topics like bionanocomposites for sustainable development. This book summarizes many developments in the field making it an ideal resource for researchers from industry, academia, government and private research institutions.
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
ISBN: 0387958681
Category : Science
Languages : en
Pages : 545
Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Publisher: Springer Science & Business Media
ISBN: 0387958681
Category : Science
Languages : en
Pages : 545
Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC)
Author: IEEE Staff
Publisher:
ISBN: 9781509027255
Category :
Languages : en
Pages :
Book Description
scientific and engineering technical conference covering all aspects of photovoltaics materials, devices, systems and reliability
Publisher:
ISBN: 9781509027255
Category :
Languages : en
Pages :
Book Description
scientific and engineering technical conference covering all aspects of photovoltaics materials, devices, systems and reliability
Recent Developments in Photovoltaic Materials and Devices
Author: Natarajan Prabaharan
Publisher: BoD – Books on Demand
ISBN: 1789854032
Category : Technology & Engineering
Languages : en
Pages : 153
Book Description
This book covers the recent advances in solar photovoltaic materials and their innovative applications. Many problems in material science are explored for enhancing the understanding of solar cells and the development of more efficient, less costly, and more stable cells. This book is crucial and relevant at this juncture and provides a historical overview focusing primarily on the exciting developments in the last decade. This book primarily covers the different Maximum Power Point Tracking control techniques that have led to the improved speed of response of solar photovoltaics, augmented search accuracy, and superior control in the presence of perturbations such as sudden variations in illumination and temperature. Furthermore, the optimal design of a photovoltaic system based on two different approaches such as consumed power and economics is discussed.
Publisher: BoD – Books on Demand
ISBN: 1789854032
Category : Technology & Engineering
Languages : en
Pages : 153
Book Description
This book covers the recent advances in solar photovoltaic materials and their innovative applications. Many problems in material science are explored for enhancing the understanding of solar cells and the development of more efficient, less costly, and more stable cells. This book is crucial and relevant at this juncture and provides a historical overview focusing primarily on the exciting developments in the last decade. This book primarily covers the different Maximum Power Point Tracking control techniques that have led to the improved speed of response of solar photovoltaics, augmented search accuracy, and superior control in the presence of perturbations such as sudden variations in illumination and temperature. Furthermore, the optimal design of a photovoltaic system based on two different approaches such as consumed power and economics is discussed.