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Author: Mark Ahlers
Publisher: SAE International
ISBN: 0768083044
Category : Technology & Engineering
Languages : en
Pages : 117
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Book Description
The simultaneous operation of all systems generating, moving, or removing heat on an aircraft is simulated using integrated analysis which is called Integrated Energy System Analysis (IESA) for this book. Its purpose is to understand, optimize, and validate more efficient system architectures for removing or harvesting the increasing amounts of waste heat generated in commercial and military aircraft. In the commercial aircraft industry IESA is driven by the desire to minimize airplane operating costs associated with increased system weight, power consumption, drag, and lost revenue as cargo space is devoted to expanded cooling systems. In military aircraft thermal IESA is also considered to be a key enabler for the successful implementation of the next generation jet fighter weapons systems and countermeasures. This book contains a selection of papers relevant to aircraft thermal management IESA published by SAE International. They cover both recently developed government and industry- funded thermal management IESA such as the Integrated Vehicle Energy Technology (INVENT) program, and older published papers still relevant today which address modeling approaches.
Author: Mark Ahlers
Publisher: SAE International
ISBN: 0768083044
Category : Technology & Engineering
Languages : en
Pages : 117
Get Book Here
Book Description
The simultaneous operation of all systems generating, moving, or removing heat on an aircraft is simulated using integrated analysis which is called Integrated Energy System Analysis (IESA) for this book. Its purpose is to understand, optimize, and validate more efficient system architectures for removing or harvesting the increasing amounts of waste heat generated in commercial and military aircraft. In the commercial aircraft industry IESA is driven by the desire to minimize airplane operating costs associated with increased system weight, power consumption, drag, and lost revenue as cargo space is devoted to expanded cooling systems. In military aircraft thermal IESA is also considered to be a key enabler for the successful implementation of the next generation jet fighter weapons systems and countermeasures. This book contains a selection of papers relevant to aircraft thermal management IESA published by SAE International. They cover both recently developed government and industry- funded thermal management IESA such as the Integrated Vehicle Energy Technology (INVENT) program, and older published papers still relevant today which address modeling approaches.
Author: Library of Congress. Copyright Office
Publisher: Copyright Office, Library of Congress
ISBN:
Category : Copyright
Languages : en
Pages : 1152
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Book Description
Includes Part 1, Number 1: Books and Pamphlets, Including Serials and Contributions to Periodicals (January - June)
Author: Wayne Stout, Phd
Publisher: DesignAerospace LLC
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 305
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Book Description
This book covers aerospace flight control systems. Both primary and secondary flight control systems are covered in the book. The first chapters cover basic mechanism fundamentals that are relevant to flight control systems. Next is chapters on cable systems, gearing systems and power screws. Hydraulic and electromechanical actuation are also discussed. From here, the book addresses general aspects of flight control systems, including fly by wire systems. After this secondary systems (high lift, spoilers, trim) and primary flight control for each axis are discussed - each in stand-alone chapters. Reversible, irreversible and fly by wire systems are discussed for each axis. The final chapter goes into system fault detection.
Author:
Publisher:
ISBN:
Category : Automobiles
Languages : en
Pages : 1020
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Book Description
Author:
Publisher:
ISBN:
Category : Airplanes
Languages : en
Pages : 784
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Book Description
Author: Ian Moir
Publisher: John Wiley & Sons
ISBN: 1119965209
Category : Technology & Engineering
Languages : en
Pages : 481
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Book Description
This third edition of Aircraft Systems represents a timely update of the Aerospace Series’ successful and widely acclaimed flagship title. Moir and Seabridge present an in-depth study of the general systems of an aircraft – electronics, hydraulics, pneumatics, emergency systems and flight control to name but a few - that transform an aircraft shell into a living, functioning and communicating flying machine. Advances in systems technology continue to alloy systems and avionics, with aircraft support and flight systems increasingly controlled and monitored by electronics; the authors handle the complexities of these overlaps and interactions in a straightforward and accessible manner that also enhances synergy with the book’s two sister volumes, Civil Avionics Systems and Military Avionics Systems. Aircraft Systems, 3rd Edition is thoroughly revised and expanded from the last edition in 2001, reflecting the significant technological and procedural changes that have occurred in the interim – new aircraft types, increased electronic implementation, developing markets, increased environmental pressures and the emergence of UAVs. Every chapter is updated, and the latest technologies depicted. It offers an essential reference tool for aerospace industry researchers and practitioners such as aircraft designers, fuel specialists, engine specialists, and ground crew maintenance providers, as well as a textbook for senior undergraduate and postgraduate students in systems engineering, aerospace and engineering avionics.
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 676
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Book Description
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
ISBN: 1441985093
Category : Technology & Engineering
Languages : en
Pages : 618
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Book Description
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Author: Ralph Remsburg
Publisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: United States. Naval Air Systems Command
Publisher:
ISBN:
Category :
Languages : en
Pages : 906
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Book Description
