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Author: Don Lancaster
Publisher: Sams Publishing
ISBN: 9780672210358
Category : Computers
Languages : en
Pages : 342
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Book Description
This best selling book has become the standard reference to TTL devices. It tells what they are, how they work, and how to use them. TTL Cookbook is filled with typical circuits and practical applications to aid the user who wants to learn about and use TTL. Book jacket.
Author: Don Lancaster
Publisher: Sams Publishing
ISBN: 9780672210358
Category : Computers
Languages : en
Pages : 342
Get Book Here
Book Description
This best selling book has become the standard reference to TTL devices. It tells what they are, how they work, and how to use them. TTL Cookbook is filled with typical circuits and practical applications to aid the user who wants to learn about and use TTL. Book jacket.
Author: Sonia Soloneski
Publisher: BoD – Books on Demand
ISBN: 9535109847
Category : Technology & Engineering
Languages : en
Pages : 218
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Book Description
This book covers alternative insect control strategies, such as the allelopathy phenomenon, tactics in integrated pest management of opportunistic generalist insect species, biological control of root pathogens, insect pest control by polyculture strategy, application of several integrated pest management programs, irrigation tactics and soil physical processes, and carbon stocks to manage weeds.
Author: Ernest E. Ludwig
Publisher:
ISBN:
Category : Chemical plants
Languages : en
Pages : 392
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Book Description
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: Sundarapandian Vaidyanathan
Publisher: Springer
ISBN: 3319517244
Category : Technology & Engineering
Languages : en
Pages : 513
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Book Description
This book reports on the latest advances in and applications of memristors, memristive devices and systems. It gathers 20 contributed chapters by subject experts, including pioneers in the field such as Leon Chua (UC Berkeley, USA) and R.S. Williams (HP Labs, USA), who are specialized in the various topics addressed in this book, and covers broad areas of memristors and memristive devices such as: memristor emulators, oscillators, chaotic and hyperchaotic memristive systems, control of memristive systems, memristor-based min-max circuits, canonic memristors, memristive-based neuromorphic applications, implementation of memristor-based chaotic oscillators, inverse memristors, linear memristor devices, delayed memristive systems, flux-controlled memristive emulators, etc. Throughout the book, special emphasis is given to papers offering practical solutions and design, modeling, and implementation insights to address current research problems in memristors, memristive devices and systems. As such, it offers a valuable reference book on memristors and memristive devices for graduate students and researchers with a basic knowledge of electrical and control systems engineering.
Author: J. P. Laible
Publisher: Springer Science & Business Media
ISBN: 3662117444
Category : Science
Languages : en
Pages : 805
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Book Description
This book is the edited proceedings of the Fifth International Conference on Finite Elements in Water Resources, held at the University of Vermont, USA in June 1984. This Conference cont inues the successful series started at Princeton University in 1976, followed by the Conference in Imperial College, London, UK in 1978, the third Conference at the University of Mississippi, USA in 1980 and the fourth at the University of Hannover, Germany in 1982. The objective of this Conference is to provide engineers and scientists interested in water resources with the state-of-t- art on finite element modelling. The Proceedings review the basic theory and applications of the technique in groundwater and seepage, transport phenomena, viscous flow, river, lake and ocean modelling. The fundamentals of the numerical techniques employed in finite elements are also discussed. Many applications illus trate the versatility and generality of the Finite Element Method for the simulation of a wide range of problems in water resources. More recent schemes, in particular, boundary elements, are also presented, together with a series of advanced numerical techniques. The Conference has become an internationally accepted forum for the presentation of new developments of finite elements in water resources techniques. Because of this, a large number of abstracts were submitted to the Organizing Committee and it is our only reg ret that it was impossible to accept all these contributions. The overwhelming response to our Call for Papers has ensured the high quality of these proceedings.
Author: Indian Agricultural Research Institute
Publisher:
ISBN:
Category : Agriculture
Languages : en
Pages : 696
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Book Description
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Yung-cheng Lee
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
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Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author: Manho Lee
Publisher: Springer
ISBN: 9789401779494
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
