Reliability and Failure of Electronic Equipment, Systems, and Mathematical Models PDF Download
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Author: Carlotta M. Vidoni
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 68
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Book Description
Author: Carlotta M. Vidoni
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 68
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Book Description
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Marius Bazu
Publisher: John Wiley & Sons
ISBN: 1119990009
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author: Stanford University. Electronics Research Laboratory
Publisher:
ISBN:
Category :
Languages : en
Pages : 74
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Book Description
Author:
Publisher:
ISBN:
Category : Reliability (Engineering)
Languages : en
Pages : 556
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Book Description
Author: Claude S. Lindquist
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 168
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Book Description
Reliability, the probability that a system will not fail but will perform correctly at least until some arbitrary time, is becoming an increasingly important concept in electronic system design. This probability is evaluated using probability density functions which are obtained analytically by forming mathematical expressions describing the failure distributions of the systems. The most commonly used expression in reliability studies is the exponential function where the reciprocal of its mean corresponds to a failure rate. When several assumptions are made, the failure rate of the system is equal to the sum to the failure rates of the components which comprise the system. After the empirical failure rate values of the components have been adjusted to conform to thermal and electrical stress conditions, they may be summed to obtain the failure rate of the system. This method was used to calculate the failure rates for various military electronic equipment. The calculated results were in close agreement with the experimental failure rates of this equipment. On-off power cycling must also be considered in reliability studies since it has the effect of adding a substantial increment of value to the basic failure rate of a system. The effective failure rate and thus reliability of a system may be found by summing the basic failure rate and the increment of value due to power cycling. It was found, using multiple regression analysis and the results from an ARINC study of cycling failure rates of various equipment, that the increment of value added to the basic system failure rate might be predicted by considering only the tubes in a system and its power cycling rate.
Author: Stanford University. Electronics Research Laboratory
Publisher:
ISBN:
Category :
Languages : en
Pages : 76
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Book Description
Author: Thomas W. Butler
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 128
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Book Description
This study revises and updates the appropriate sections of Military Handbook 217B, 'Reliability Prediction of Electronic Equipment, ' pertaining to semi-conductor devices, section 2.2. More than 200 billion part-hours of field operating data were collected and analyzed during the study effort. Significant revisions were made to environmental factors and some quality factors. (Author).
Author: Michael Todinov
Publisher: John Wiley & Sons
ISBN: 1118873254
Category : Technology & Engineering
Languages : en
Pages : 441
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Book Description
A comprehensively updated and reorganized new edition. The updates include comparative methods for improving reliability; methods for optimal allocation of limited resources to achieve a maximum risk reduction; methods for improving reliability at no extra cost and building reliability networks for engineering systems. Includes: A unique set of 46 generic principles for reducing technical risk Monte Carlo simulation algorithms for improving reliability and reducing risk Methods for setting reliability requirements based on the cost of failure New reliability measures based on a minimal separation of random events on a time interval Overstress reliability integral for determining the time to failure caused by overstress failure modes A powerful equation for determining the probability of failure controlled by defects in loaded components with complex shape Comparative methods for improving reliability which do not require reliability data Optimal allocation of limited resources to achieve a maximum risk reduction Improving system reliability based solely on a permutation of interchangeable components
Author: Jan Pukite
Publisher: John Wiley & Sons
ISBN: 0780334825
Category : Computers
Languages : en
Pages : 290
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Book Description
"Markov modeling has long been accepted as a fundamental and powerful technique for the fault tolerance analysis of mission-critical applications. However, the elaborate computations required have often made Markov modeling too time-consuming to be of practical use on these complex systems. With this hands-on tool, designers can use the Markov modeling technique to analyze safety, reliability, maintainability, and cost-effectiveness factors in the full range of complex systems in use today. Featuring ground-breaking simulation software and a comprehensive reference manual, MARKOV MODELING FOR RELIABILITY ANALYSIS helps system designers surmount the mathematical computations that have previously prevented effective reliability analysis. The text and software compose a valuable self-study tool that is complete with detailed explanations, examples, and a library of Markov models that can be used for experiments and as derivations for new simulation models. The book details how these analyses are conducted, while providing hands-on instruction on how to develop reliability models for the full range of system configurations. Computer-Aided Rate Modeling and Simulation (CARMS) software is an integrated modeling tool that includes a diagram-based environment for model setup, a spreadsheet like interface for data entry, an expert system link for automatic model construction, and an interactive graphic interface for displaying simulation results."
