Recent Advances in Microelectronics Reliability PDF Download
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Author: Willem Dirk van Driel
Publisher: Springer Nature
ISBN: 3031593618
Category :
Languages : en
Pages : 405
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Book Description
Author: Willem Dirk van Driel
Publisher: Springer Nature
ISBN: 3031593618
Category :
Languages : en
Pages : 405
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Book Description
Author: Soumia El Hani
Publisher: Springer
ISBN: 3030052761
Category : Technology & Engineering
Languages : en
Pages : 208
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Book Description
The book includes the best extended papers which were selected from the 3rd International Conference of Electrical and Information Technologies (ICEIT 2017, Morocco). The book spans two inter-related research domains which shaped modern societies, solved many of their development problems, and contributed to their unprecedented economic growth and social welfare. Selected papers are based on original and high quality research. They were peer reviewed by experts in the field. They are grouped into five parts. Part I deals with Power System and Electronics topics that include Power Electronics & Energy Conversion, Actuators & Micro/Nanotechnology, etc. Part II relates to Control Systems and their applications. Part III concerns the topic of Information Technology that basically includes Smart Grid, Information Security, Cloud Computing Distributed, Big Data, etc. Part IV discusses Telecommunications and Vehicular Technologies topics that include, Green Networking and Communications, Wireless Ad-hoc and Sensor Networks, etc. Part V covers Green Applications and Interdisciplinary topics, that include intelligent and Green Technologies for Transportation Systems, Smart Cities, etc. This book offers a good opportunity for young researchers, novice scholars and whole academic sphere to explore new trends in Electrical and information Technologies.
Author: Ninoslav D. Stojadinović
Publisher:
ISBN:
Category :
Languages : en
Pages : 120
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Book Description
Author: Joseph B. Bernstein
Publisher: John Wiley & Sons
ISBN: 1394210930
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Author: Joseph B. Bernstein
Publisher: John Wiley & Sons
ISBN: 1394210957
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Author: Rajesh Gomatam
Publisher: BRILL
ISBN: 9004165924
Category : Technology & Engineering
Languages : en
Pages : 434
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Book Description
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author: Esteban Tlelo-Cuautle
Publisher: BoD – Books on Demand
ISBN: 9533073233
Category : Technology & Engineering
Languages : en
Pages : 384
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Book Description
This book highlights key design issues and challenges to guarantee the development of successful applications of analog circuits. Researchers around the world share acquired experience and insights to develop advances in analog circuit design, modeling and simulation. The key contributions of the sixteen chapters focus on recent advances in analog circuits to accomplish academic or industrial target specifications.
Author: Way Kuo
Publisher: Springer Science & Business Media
ISBN: 1461556716
Category : Technology & Engineering
Languages : en
Pages : 407
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Book Description
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Author: Evangelos Triantaphyllou
Publisher: World Scientific
ISBN: 9814472174
Category : Computers
Languages : en
Pages : 816
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Book Description
The main goal of the new field of data mining is the analysis of large and complex datasets. Some very important datasets may be derived from business and industrial activities. This kind of data is known as “enterprise data”. The common characteristic of such datasets is that the analyst wishes to analyze them for the purpose of designing a more cost-effective strategy for optimizing some type of performance measure, such as reducing production time, improving quality, eliminating wastes, or maximizing profit. Data in this category may describe different scheduling scenarios in a manufacturing environment, quality control of some process, fault diagnosis in the operation of a machine or process, risk analysis when issuing credit to applicants, management of supply chains in a manufacturing system, or data for business related decision-making.
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 0470065419
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
