Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 PDF Download
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Author: K. Kondo
Publisher: The Electrochemical Society
ISBN: 1607686716
Category :
Languages : en
Pages : 119
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Book Description
Author: K. Kondo
Publisher: The Electrochemical Society
ISBN: 1607686716
Category :
Languages : en
Pages : 119
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Book Description
Author: K. Kondo
Publisher: The Electrochemical Society
ISBN: 1607686201
Category : Science
Languages : en
Pages : 140
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Book Description
Author: J. C. Flake
Publisher: The Electrochemical Society
ISBN: 1566778123
Category : Science
Languages : en
Pages : 171
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Book Description
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Author: K. Kondi
Publisher:
ISBN: 9781623323134
Category :
Languages : en
Pages :
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Book Description
Author: Chuan Seng Tan
Publisher: Springer Science & Business Media
ISBN: 0387765344
Category : Technology & Engineering
Languages : en
Pages : 365
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Book Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9811209634
Category : Packaging
Languages : en
Pages : 1079
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Book Description
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773935
Category : Technology & Engineering
Languages : en
Pages : 438
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Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
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Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774178
Category : Dielectrics
Languages : en
Pages : 508
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Book Description
