Author: T. O. Herndon
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials
Author: T. O. Herndon
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Cleaning Technology in Semiconductor Device Manufacturing
Author:
Publisher: The Electrochemical Society
ISBN: 9781566772594
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772594
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Handbook for Cleaning for Semiconductor Manufacturing
Author: Karen A. Reinhardt
Publisher: John Wiley & Sons
ISBN: 1118099516
Category : Technology & Engineering
Languages : en
Pages : 596
Book Description
Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Publisher: John Wiley & Sons
ISBN: 1118099516
Category : Technology & Engineering
Languages : en
Pages : 596
Book Description
Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Cleaning Technology in Semiconductor Device Manufacturing ...
Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 636
Book Description
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 636
Book Description
Optical Characterization Techniques for High-performance Microelectronic Device Manufacturing
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 324
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 324
Book Description
Index of Conference Proceedings
Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 976
Book Description
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 976
Book Description
Development of Conventional and Time-of-flight Neutron Depth Profiling at Cornell
Author: Zhiqiang Li
Publisher:
ISBN:
Category :
Languages : en
Pages : 234
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 234
Book Description
Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging
Author: James R. Lloyd
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
Book Description
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
Book Description
Chemical Abstracts Service Source Index
Author: American Chemical Society. Chemical Abstracts Service
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2064
Book Description
A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2064
Book Description
A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.
Subject Guide to Books in Print
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 3310
Book Description
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 3310
Book Description