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Author: E. F. Jacob
Publisher:
ISBN: 9780804707732
Category :
Languages : en
Pages :
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Book Description
Author: E. F. Jacob
Publisher:
ISBN: 9780804707732
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Heat Transfer and Fluid Mechanics Institute
Publisher:
ISBN:
Category : Fluid mechanics
Languages : en
Pages : 280
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Book Description
Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
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Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953
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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: National Agricultural Library (U.S.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 1338
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Author: National Agricultural Library (U.S.)
Publisher:
ISBN:
Category : Agriculture
Languages : en
Pages : 1392
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Author:
Publisher:
ISBN:
Category : Cover title
Languages : en
Pages : 884
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Author: Karel A. Kase
Publisher:
ISBN:
Category : Saline water conversion
Languages : en
Pages : 68
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Author: Aerojet-General Corporation
Publisher:
ISBN:
Category : Rocket engines
Languages : en
Pages : 352
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Book Description
