Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing PDF Download
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Author: Richard E. Novak
Publisher: The Electrochemical Society
ISBN: 9781566771153
Category : Technology & Engineering
Languages : en
Pages : 642
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Book Description
Author: Richard E. Novak
Publisher: The Electrochemical Society
ISBN: 9781566771153
Category : Technology & Engineering
Languages : en
Pages : 642
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Book Description
Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
ISBN: 9781566774116
Category : Technology & Engineering
Languages : en
Pages : 452
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Book Description
Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
ISBN: 9781566771887
Category : Technology & Engineering
Languages : en
Pages : 668
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Book Description
Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 458
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566772594
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
Author: Jerzy Ruzyllo
Publisher:
ISBN:
Category :
Languages : en
Pages : 399
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Book Description
Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566771368
Category : Technology & Engineering
Languages : en
Pages : 366
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Book Description
Author: Jerzy Rużyłło
Publisher:
ISBN: 9781566773591
Category : House & Home
Languages : en
Pages : 374
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Book Description
Author: Karen Reinhardt
Publisher: William Andrew
ISBN: 032351085X
Category : Technology & Engineering
Languages : en
Pages : 794
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Book Description
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Author: Takeshi Hattori
Publisher: The Electrochemical Society
ISBN: 1566777429
Category : Semiconductor wafers
Languages : en
Pages : 407
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Book Description
This issue of ECS Transactions includes papers presented during the 11th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing held during the ECS Fall Meeting in Vienna, Austria, October 4-9, 2009.
