Proceedings of the ASME Heat Transfer Division--2006 PDF Download
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Author:
Publisher:
ISBN: 9780791847848
Category : Heat
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN: 9780791847848
Category : Heat
Languages : en
Pages :
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Book Description
Author: American Society of Mechanical Engineers. Heat Transfer Division
Publisher:
ISBN: 9780791835647
Category : Heat
Languages : en
Pages : 0
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Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages :
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Author:
Publisher:
ISBN:
Category : Combustion
Languages : en
Pages : 820
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Author:
Publisher:
ISBN:
Category : Combustion
Languages : en
Pages : 682
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Author:
Publisher: Editora E-papers
ISBN: 8587922440
Category :
Languages : en
Pages : 413
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Book Description
Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
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Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Author: American Society of Mechanical Engineers Heat Transfer Division
Publisher:
ISBN: 9780791816561
Category :
Languages : en
Pages : 443
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Book Description
Author: C.B. Sobhan
Publisher: CRC Press
ISBN: 1000654214
Category : Science
Languages : en
Pages : 317
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Book Description
Through analyses, experimental results, and worked-out numerical examples, Microscale and Nanoscale Heat Transfer: Fundamentals and Engineering Applications explores the methods and observations of thermophysical phenomena in size-affected domains. Compiling the most relevant findings from the literature, along with results from their own re
Author: S. Kakaç
Publisher: Springer Science & Business Media
ISBN: 1402033613
Category : Technology & Engineering
Languages : en
Pages : 517
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Book Description
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.