Proceedings of the 4th Symposium on Ultrasonic Electronics PDF Download
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Author:
Publisher:
ISBN:
Category : Acoustic surface wave devices
Languages : en
Pages : 258
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Book Description
Author:
Publisher:
ISBN:
Category : Acoustic surface wave devices
Languages : en
Pages : 258
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Book Description
Author:
Publisher:
ISBN:
Category : Physics
Languages : en
Pages : 942
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Book Description
Author: Hiroyuki Kajimoto
Publisher: Springer
ISBN: 4431557725
Category : Technology & Engineering
Languages : en
Pages : 303
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Book Description
This book examines the state of the art in diverse areas of haptics (touch)-related research, including the psychophysics and neurophysiology of haptics, development of haptics displays and sensors, and applications to a wide variety of fields such as industry, education, therapy, medicine, and welfare for the visually impaired. It also discusses the potential of future haptics interaction, such as haptics for emotional control and remote haptics communication. The book offers a valuable resource not only for haptics and human interface researchers, but also for developers and designers at manufacturing corporations and in the entertainment industries.
Author: National Library of Medicine (U.S.)
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 1068
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Book Description
First multi-year cumulation covers six years: 1965-70.
Author: Cornelius T. Leondes
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
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Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Keith Wang
Publisher: Springer Science & Business Media
ISBN: 1468437550
Category : Science
Languages : en
Pages : 829
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Book Description
This volume contains forty-six of the papers presented at the Ninth International Symposium on Acoustical Imaging held December 3-6, 1979, in Houston, Texas. The theme of the confer ence was the integration of applications technology. The major objective of the conference was to promote interaction among researchers working on different applications of acoustical imaging. In addition to serving as a state-of-the-art research ref erence, this volume includes six tutorial review papers. For convenience, all the papers are grouped under the following headings: methods, transducers, processing and display, phased array considerations, acoustic microscopy/non-destructive evalu ation, reconstructive tomography and inversion techniques, tissue characterization and impediography, nedica1 applications, under water applications, and seismic applications. The editor would like to thank the authors and the confer ence participants. The editor would also like to express his appreciation for the assistance in evaluating the abstracts from the following members of the Program Committee: Mahfuz Ahmed, University of California Irvine l:1edica1 Center; Pierre A1ais, Paris University, France; C.B. Burckhardt, Hoffman-Laroche, Basel, Switzerland; B.P. Hildebrand, Spectron Development Labora tories, Inc., Costa Mesa, California; Larry W. Kessler, Sonoscan, Inc., Bensenville, Illinois; Rolf Uue11er, University of Hinnesota, l1inneapo1is, Uinnesota; John P. Powers, Naval Post Graduate School, J:1onterey, California; Jerry L. Sutton, Naval Ocean Systems Center, San Diego, California; F.L. Thurstone, Duke University, Durham, North Carolina; Robert C. Waag, University of Rochester, Rochester, New York; and Glen Wade, University of California, Santa Barbara, California.
Author: Krzysztof Iniewski
Publisher: CRC Press
ISBN: 1351831917
Category : Technology & Engineering
Languages : en
Pages : 601
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Book Description
Sensor technologies are a rapidly growing area of interest in science and product design, embracing developments in electronics, photonics, mechanics, chemistry, and biology. Their presence is widespread in everyday life, where they are used to sense sound, movement, and optical or magnetic signals. The demand for portable and lightweight sensors is relentless in several industries, from consumer electronics to biomedical engineering to the military. Smart Sensors for Industrial Applications brings together the latest research in smart sensors technology and exposes the reader to myriad applications that this technology has enabled. Organized into five parts, the book explores: Photonics and optoelectronics sensors, including developments in optical fibers, Brillouin detection, and Doppler effect analysis. Chapters also look at key applications such as oxygen detection, directional discrimination, and optical sensing. Infrared and thermal sensors, such as Bragg gratings, thin films, and microbolometers. Contributors also cover temperature measurements in industrial conditions, including sensing inside explosions. Magnetic and inductive sensors, including magnetometers, inductive coupling, and ferro-fluidics. The book also discusses magnetic field and inductive current measurements in various industrial conditions, such as on airplanes. Sound and ultrasound sensors, including underwater acoustic modem, vibrational spectroscopy, and photoacoustics. Piezoresistive, wireless, and electrical sensors, with applications in health monitoring, agrofood, and other industries. Featuring contributions by experts from around the world, this book offers a comprehensive review of the groundbreaking technologies and the latest applications and trends in the field of smart sensors.
Author: Ernesto Suaste-Gomez
Publisher: BoD – Books on Demand
ISBN: 9533071222
Category : Technology & Engineering
Languages : en
Pages : 306
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Book Description
This book reviews a big window of opportunity for piezoelectric ceramics, such as new materials, material combinations, structures, damages and porosity effects. In addition, applications of sensors, actuators, transducers for ultrasonic imaging, positioning systems, energy harvesting, biomedical and microelectronic devices are described. The book consists of fourteen chapters. The genetic algorithm is used for identification of RLC parameters in the equivalent electrical circuit of piezoelectric transducers. Concept and development perspectives for piezoelectric energy harvesting are described. The characterization of principal properties and advantages of a novel device called ceramic-controlled piezoelectric with a Pt wire implant is included. Bio-compatibility studies between piezoelectric ceramic material and biological cell suspension are exposed. Thus, piezoelectric ceramics have been a very favorable solution as a consequence of its high energy density and the variety of fabrication techniques to obtain bulk or thin films devices. Finally, the readers will perceive a trend analysis and examine recent developments in different fields of applications of piezoelectric ceramics.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
