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Author:
Publisher:
ISBN:
Category : CAD/CAM systems
Languages : en
Pages : 876
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Book Description
Author:
Publisher:
ISBN:
Category : CAD/CAM systems
Languages : en
Pages : 712
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Book Description
Author: Thomas Neele
Publisher: Springer Nature
ISBN: 3031661494
Category :
Languages : en
Pages : 274
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Book Description
Author: Osvaldo Gervasi
Publisher: Springer Nature
ISBN: 3031371119
Category : Computers
Languages : en
Pages : 722
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Book Description
This nine-volume set LNCS 14104 – 14112 constitutes the refereed workshop proceedings of the 23rd International Conference on Computational Science and Its Applications, ICCSA 2023, held at Athens, Greece, during July 3–6, 2023. The 350 full papers and 29 short papers and 2 PHD showcase papers included in this volume were carefully reviewed and selected from a total of 876 submissions. These nine-volumes includes the proceedings of the following workshops: Advances in Artificial Intelligence Learning Technologies: Blended Learning, STEM, Computational Thinking and Coding (AAILT 2023); Advanced Processes of Mathematics and Computing Models in Complex Computational Systems (ACMC 2023); Artificial Intelligence supported Medical data examination (AIM 2023); Advanced and Innovative web Apps (AIWA 2023); Assessing Urban Sustainability (ASUS 2023); Advanced Data Science Techniques with applications in Industry and Environmental Sustainability (ATELIERS 2023); Advances in Web Based Learning (AWBL 2023); Blockchain and Distributed Ledgers: Technologies and Applications (BDLTA 2023); Bio and Neuro inspired Computing and Applications (BIONCA 2023); Choices and Actions for Human Scale Cities: Decision Support Systems (CAHSC-DSS 2023); and Computational and Applied Mathematics (CAM 2023).
Author: Yuan Xie
Publisher: Springer Science & Business Media
ISBN: 144190784X
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Author: Charles J. Alpert
Publisher: CRC Press
ISBN: 1000654192
Category : Computers
Languages : en
Pages : 1044
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Book Description
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Author: Meng Li
Publisher: Springer Nature
ISBN: 3030412474
Category : Technology & Engineering
Languages : en
Pages : 147
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Book Description
This book proposes a synergistic framework to help IP vendors to protect hardware IP privacy and integrity from design, optimization, and evaluation perspectives. The proposed framework consists of five interacting components that directly target at the primary IP violations. All the five algorithms are developed based on rigorous mathematical modeling for primary IP violations and focus on different stages of IC design, which can be combined to provide a formal security guarantee.
Author: Richard Zurawski
Publisher: CRC Press
ISBN: 1351834177
Category : Technology & Engineering
Languages : en
Pages : 850
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Book Description
Considered a standard industry resource, the Embedded Systems Handbook provided researchers and technicians with the authoritative information needed to launch a wealth of diverse applications, including those in automotive electronics, industrial automated systems, and building automation and control. Now a new resource is required to report on current developments and provide a technical reference for those looking to move the field forward yet again. Divided into two volumes to accommodate this growth, the Embedded Systems Handbook, Second Edition presents a comprehensive view on this area of computer engineering with a currently appropriate emphasis on developments in networking and applications. Those experts directly involved in the creation and evolution of the ideas and technologies presented offer tutorials, research surveys, and technology overviews that explore cutting-edge developments and deployments and identify potential trends. This first self-contained volume of the handbook, Embedded Systems Design and Verification, is divided into three sections. It begins with a brief introduction to embedded systems design and verification. It then provides a comprehensive overview of embedded processors and various aspects of system-on-chip and FPGA, as well as solutions to design challenges. The final section explores power-aware embedded computing, design issues specific to secure embedded systems, and web services for embedded devices. Those interested in taking their work with embedded systems to the network level should complete their study with the second volume: Network Embedded Systems.
Author: Emmanuel Jeannot
Publisher: John Wiley & Sons
ISBN: 1118712056
Category : Computers
Languages : en
Pages : 512
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Book Description
With recent changes in multicore and general-purpose computing on graphics processing units, the way parallel computers are used and programmed has drastically changed. It is important to provide a comprehensive study on how to use such machines written by specialists of the domain. The book provides recent research results in high-performance computing on complex environments, information on how to efficiently exploit heterogeneous and hierarchical architectures and distributed systems, detailed studies on the impact of applying heterogeneous computing practices to real problems, and applications varying from remote sensing to tomography. The content spans topics such as Numerical Analysis for Heterogeneous and Multicore Systems; Optimization of Communication for High Performance Heterogeneous and Hierarchical Platforms; Efficient Exploitation of Heterogeneous Architectures, Hybrid CPU+GPU, and Distributed Systems; Energy Awareness in High-Performance Computing; and Applications of Heterogeneous High-Performance Computing. • Covers cutting-edge research in HPC on complex environments, following an international collaboration of members of the ComplexHPC • Explains how to efficiently exploit heterogeneous and hierarchical architectures and distributed systems • Twenty-three chapters and over 100 illustrations cover domains such as numerical analysis, communication and storage, applications, GPUs and accelerators, and energy efficiency
Author: Bei Yu
Publisher: Springer
ISBN: 3319203851
Category : Technology & Engineering
Languages : en
Pages : 173
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Book Description
This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
Author: Yangdong Deng
Publisher: Springer Science & Business Media
ISBN: 3642041574
Category : Technology & Engineering
Languages : en
Pages : 211
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Book Description
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
