Proceedings of the 12-th Conference of the International Society for Hybrid Microelectronice--Poland Chapter, Gdańsk-Sobieszewo, 14-17 September 1988 PDF Download
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Author: International Society for Hybrid Microelectronics--Poland Chapter. Conference
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 142
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Book Description
Author: International Society for Hybrid Microelectronics--Poland Chapter. Conference
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 142
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Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 792
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Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 390
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Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 856
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Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1594
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Author:
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ISBN:
Category : Catalogs, Union
Languages : en
Pages : 1032
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Book Description
Includes entries for maps and atlases.
Author: Thomas Noulis
Publisher: CRC Press
ISBN: 1351642782
Category : Technology & Engineering
Languages : en
Pages : 555
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Book Description
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Author: British Library. Lending Division
Publisher:
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Category : Congresses and conventions
Languages : en
Pages : 456
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Author:
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ISBN:
Category : Adhesives
Languages : en
Pages : 404
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Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 592
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