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Author:
Publisher:
ISBN:
Category : Industrial electronics
Languages : en
Pages : 706
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Book Description
Author:
Publisher:
ISBN:
Category : Industrial electronics
Languages : en
Pages : 706
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Industrial electronics
Languages : en
Pages : 420
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Book Description
Author: Fang Lin Luo
Publisher: CRC Press
ISBN: 1315393778
Category : Technology & Engineering
Languages : en
Pages : 775
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Book Description
DC/DC conversion techniques have undergone rapid development in recent decades. With the pioneering work of authors Fang Lin Luo and Hong Ye, DC/DC converters have now been sorted into their six generations, and by a rough count, over 800 different topologies currently exist, with more being developed each year. Advanced DC/DC Converters, Second Edition offers a concise, practical presentation of DC/DC converters, summarizes the spectrum of conversion technologies, and presents new ideas and more than 200 new topologies. Beginning with background material on DC/DC conversion, the book later discusses both voltage lift and super-lift converters. It then proceeds through each generation, including the groundbreaking sixth generation—converters developed by the authors that can be cascaded for high voltage transfer gain. This new edition updates every chapter and offers three new chapters. The introduction of the super-lift technique is an outstanding achievement in DC/DC conversion technology, and the ultra-lift technique and hybrid split-capacitor/inductor applied in Super-Lift Luo-Converters are introduced in Chapters 7 and 8. In Chapter 9, the authors have theoretically defined a new concept, Energy Factor (EF), researched the relations between EF and the mathematical modelling for power DC/DC converters, and demonstrated the modeling method for two converters. More than 320 figures, 60 tables, and 500 formulae allow the reader to more easily grasp the overall structure of advanced DC/DC converters, provide fast access to precise data, and help them to quickly determine the values of their own circuit components.
Author: Management Association, Information Resources
Publisher: IGI Global
ISBN: 1605669873
Category : Technology & Engineering
Languages : en
Pages : 2041
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Book Description
"This multiple-volume publications exhibits the most up-to-date collection of research results and recent discoveries in the transfer of knowledge access across the globe"--Provided by publisher.
Author: Dumitru Baleanu
Publisher: BoD – Books on Demand
ISBN: 9535104942
Category : Computers
Languages : en
Pages : 650
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Book Description
The use of the wavelet transform to analyze the behaviour of the complex systems from various fields started to be widely recognized and applied successfully during the last few decades. In this book some advances in wavelet theory and their applications in engineering, physics and technology are presented. The applications were carefully selected and grouped in five main sections - Signal Processing, Electrical Systems, Fault Diagnosis and Monitoring, Image Processing and Applications in Engineering. One of the key features of this book is that the wavelet concepts have been described from a point of view that is familiar to researchers from various branches of science and engineering. The content of the book is accessible to a large number of readers.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Weiming Shen
Publisher: Springer Science & Business Media
ISBN: 0387365907
Category : Technology & Engineering
Languages : en
Pages : 509
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Book Description
BASYS conferences were initially organized to promote the development of balanced automation systems. The first BASYS conference was successfully launched in Victoria, Brazil, in 1995. BASYS'06 is the 7th edition in this series. This book comprises three invited keynote papers and forty-nine regular papers accepted for presentation at the conference. All together, these papers will make significant contributions to the literature of Intelligent Technology for Balanced Manufacturing Systems.
Author: K Sundareswaran
Publisher: CRC Press
ISBN: 0429751540
Category : Technology & Engineering
Languages : en
Pages : 390
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Book Description
Fills the gap for a concise preliminary textbook on power electronic drives, with simple illustrations and applications Presents the integration of power electronics and machines in a simple manner Discusses the principles of electric motors and power electronics in an introductory manner Discusses DC and AC drives, with an emphasis on PM drives Includes questions and homework problems with hints and case studies
Author: Sasaki, Hideyasu
Publisher: IGI Global
ISBN: 1613501366
Category : Law
Languages : en
Pages : 365
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Book Description
Information technology for intellectual property protection has become an increasingly important issue due to the expansion of ubiquitous network connectivity, which allows people to use digital content and programs that are susceptible to unauthorized electric duplication or copyright and patent infringement. Information Technology for Intellectual Property Protection: Interdisciplinary Advancements contains multidisciplinary knowledge and analysis by leading researchers and practitioners with technical backgrounds in information engineering and institutional experience in intellectual property practice. Through its discussions of both engineering solutions and the social impact of institutional protection, this book fills a gap in the existing literature and provides methods and applications for both practitioners and IT engineers.
Author: Shane (Shengquan) Xie
Publisher: Springer Science & Business Media
ISBN: 184996341X
Category : Technology & Engineering
Languages : en
Pages : 453
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Book Description
Rapid One-of-a-kind Product Development discusses research in the development of new enabling technologies for small and medium companies. Scientific advancements presented include a novel product data modelling scheme to model product design, manufacturability and knowledge under a common data object; customised product development in a distributed environment; and new adaptive scheduling methods for the optimal production of a wide variety of customised products, taking into consideration all of the possible changes from customers and the uncertainties in manufacturing. The book also includes research towards a computer aided customer interface, which allows customer requirements and changes to be processed and integrated with technical designs in real time; adaptive and concurrent CAD methods and algorithms; and product modelling and system integration technologies. The reader will learn how to: • translate customer requirements to technical attributes; • develop new and innovative products to meet customer requirements and expectations; • evaluate and optimise a project design; • design production systems and use them efficiently; and • manage a variety of customised products. Rapid One-of-a-kind Product Development demonstrates how to develop new methods, tools and algorithms to address the problems in a mass customisation environment. It is a valuable source of information for researchers and engineers in the fields of design and manufacturing.
