Polycrystalline Silicon, Metal Silicides, and CVD Metals for Integrated-circuit Applications PDF Download
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Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 600
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 600
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Book Description
Author: Ted Kamins
Publisher: Springer Science & Business Media
ISBN: 1461316812
Category : Technology & Engineering
Languages : en
Pages : 302
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Book Description
Recent years have seen silicon integrated circuits enter into an increasing number of technical and consumer applications, until they now affect everyday life, as well as technical areas. Polycrystalline silicon has been an important component of silicon technology for nearly two decades, being used first in MOS integrated circuits and now becoming pervasive in bipolar circuits, as well. During this time a great deal of informa tion has been published about polysilicon. A wide range of deposition conditions has been used to form films exhibiting markedly different properties. Seemingly contradictory results can often be explained by considering the details of the structure formed. This monograph is an attempt to synthesize much of the available knowledge about polysilicon. It represents an effort to interrelate the deposition, properties, and applications of polysilicon so that it can be used most effectively to enhance device and integrated-circuit perfor mance. As device performance improves, however, some of the proper ties of polysilicon are beginning to restrict the overall performance of integrated circuits, and the basic limitations of the properties of polysili con also need to be better understood to minimize potential degradation of circuit behavior.
Author: Shyam P. Murarka
Publisher: Academic Press
ISBN: 0080570569
Category : Technology & Engineering
Languages : en
Pages : 213
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Book Description
Most of the subject matter of this book has previously been available only in the form of research papers and review articles. I have not attempted to refer to all the published papers. The reader may find it advantageous to refer to the references listed.
Author: Karen Maex
Publisher: Institution of Electrical Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 358
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Book Description
The properties of silicon alloyed with metals are presented here for silicides of both transition and rare earth metals.
Author: Francois D'heurle
Publisher: World Scientific
ISBN: 9814492183
Category : Science
Languages : en
Pages : 390
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Book Description
Silicides were introduced into the technology of electronic devices some thirty years ago; since then, they have been continuously used to form both ohmic and rectifying contacts to silicon. Silicides are also important for other applications (thermoelectric devices and structural applications, such as jet engines), but it is not easy to find an updated reference containing both their basic properties, either chemical or physical, and the latest applications.The 16th Course of the International School of Solid State Physics, held in Erice (Italy) in the late spring of 1999, was intended to break artificial barriers between disciplines, and to gather people concerned with the properties and applications of silicides, regardless of the formal fields to which they belong, or of the practical goals they pursue. This book is therefore concerned with theory as well as applications, metallurgy as well as physics, and materials science as well as microelectronics.
Author: Howard R. Huff
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 1076
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Book Description
Author: D. Widmann
Publisher: Springer Science & Business Media
ISBN: 366204160X
Category : Technology & Engineering
Languages : en
Pages : 355
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Book Description
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
Author: Munir H. Nayfeh
Publisher: Elsevier
ISBN: 044318674X
Category : Technology & Engineering
Languages : en
Pages : 568
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Book Description
Integrated Silicon-Metal Systems at the Nanoscale: Applications in Photonics, Quantum Computing, Networking, and Internet is a comprehensive guide to the interaction, materials and functional integration at the nanoscale of the silicon-metal binary system and a variety of emerging and next-generation advanced device applications, from energy and electronics, to sensing, quantum computing and quantum internet networks. The book guides the readers through advanced techniques and etching processes, combining underlying principles, materials science, design, and operation of metal-Si nanodevices. Each chapter focuses on a specific use of integrated metal-silicon nanostructures, including storage and resistive next-generation nano memory and transistors, photo and molecular sensing, harvest and storage device electrodes, phosphor light converters, and hydrogen fuel cells, as well as future application areas, such as spin transistors, quantum computing, hybrid quantum devices, and quantum engineering, networking, and internet. Provides detailed coverage of materials, design and operation of metal-Si nanodevices Offers a step-by-step approach, supported by principles, methods, illustrations and equations Explores a range of cutting-edge emerging applications across electronics, sensing and quantum computing
Author: F. Roozeboom
Publisher: The Electrochemical Society
ISBN: 1566778638
Category : Science
Languages : en
Pages : 377
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Book Description
This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.
Author: Electrochemical Society. High Temperature Materials Division
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 1296
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Book Description
