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Author: Inna P. Vaisband
Publisher: Springer
ISBN: 3319293958
Category : Technology & Engineering
Languages : en
Pages : 742
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Book Description
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author: Inna P. Vaisband
Publisher: Springer
ISBN: 3319293958
Category : Technology & Engineering
Languages : en
Pages : 742
Get Book
Book Description
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author: Gadi Eisenstein
Publisher: Springer
ISBN: 3319670026
Category : Technology & Engineering
Languages : en
Pages : 291
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Book Description
This books focuses on recent break-throughs in the development of a variety of photonic devices, serving distances ranging from mm to many km, together with their electronic counter-parts, e.g. the drivers for lasers, the amplifiers following the detectors and most important, the relevant advanced VLSI circuits. It explains that as a consequence of the increasing dominance of optical interconnects for high performance workstation clusters and supercomputers their complete design has to be revised. This book thus covers for the first time the whole variety of interdependent subjects contributing to green photonics and electronics, serving communication and energy harvesting. Alternative approaches to generate electric power using organic photovoltaic solar cells, inexpensive and again energy efficient in production are summarized. In 2015, the use of the internet consumed 5-6% of the raw electricity production in developed countries. Power consumption increases rapidly and without some transformational change will use, by the middle of the next decade at the latest, the entire electricity production. This apocalyptic outlook led to a redirection of the focus of data center and HPC developers from just increasing bit rates and capacities to energy efficiency. The high speed interconnects are all based on photonic devices. These must and can be energy efficient but they operate in an electronic environment and therefore have to be considered in a wide scope that also requires low energy electronic devices, sophisticated circuit designs and clever architectures. The development of the next generation of high performance exaFLOP computers suffers from the same problem: Their energy consumption based on present device generations is essentially prohibitive.
Author: Haruo Kobayashi
Publisher: CRC Press
ISBN: 9814613169
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
This comprehensive book focuses on DC–DC switching power supply circuits, which are receiving attention as a key technology in green IT, especially in the automotive and consumer electronics industries. It covers buck converters, isolated converters, PFC converters, their modeling and analysis, several control methods, passive components, and their several recent applications (on-chip power supplies, DC–DC and AC–DC converter applications, single-inductor multi-output DC–DC converters, energy harvest applications, wireless power delivery, charge pump circuits, and power amplifiers). The contents are well balanced as the authors are from both academia and industry and include pioneers and inventors of hysteretic PWM control.
Author: Paul D. Franzon
Publisher: John Wiley & Sons
ISBN: 3527697047
Category : Technology & Engineering
Languages : en
Pages : 265
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Book Description
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author: Carolina Metzler
Publisher: Springer Nature
ISBN: 3030532739
Category : Computers
Languages : en
Pages : 355
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Book Description
This book contains extended and revised versions of the best papers presented at the 27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, held in Cusco, Peru, in October 2019. The 15 full papers included in this volume were carefully reviewed and selected from the 28 papers (out of 82 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
Author: John Hu
Publisher: Springer Science & Business Media
ISBN: 1441995269
Category : Technology & Engineering
Languages : en
Pages : 128
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Book Description
This book will introduce various power management integrated circuits (IC) design techniques to build future energy-efficient “green” electronics. The goal is to achieve high efficiency, which is essential to meet consumers’ growing need for longer battery lives. The focus is to study topologies amiable for full on-chip implementation (few external components) in the mainstream CMOS technology, which will reduce the physical size and the manufacturing cost of the devices.
Author: Seda Ogrenci-Memik
Publisher: IET
ISBN: 1849199345
Category : Computers
Languages : en
Pages : 264
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Book Description
Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.
Author: Yu Hao
Publisher: World Scientific
ISBN: 9814699039
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Author: Masanori Hashimoto
Publisher: McGraw Hill Professional
ISBN: 0071787771
Category : Technology & Engineering
Languages : en
Pages : 417
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Book Description
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Author: Mona M. Hella
Publisher: CRC Press
ISBN: 1482228947
Category : Technology & Engineering
Languages : en
Pages : 329
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Book Description
Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.
