On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits PDF Download
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Author: Qiang Cui
Publisher: Springer
ISBN: 3319108190
Category : Technology & Engineering
Languages : en
Pages : 99
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Book Description
This book enables readers to design effective ESD protection solutions for all mainstream RF fabrication processes (GaAs pHEMT, SiGe HBT, CMOS). The new techniques introduced by the authors have much higher protection levels and much lower parasitic effects than those of existing ESD protection devices. The authors describe in detail the ESD phenomenon, as well as ESD protection fundamentals, standards, test equipment, and basic design strategies. Readers will benefit from realistic case studies of ESD protection for RFICs and will learn to increase significantly modern RFICs’ ESD safety level, while maximizing RF performance.
Author: Qiang Cui
Publisher: Springer
ISBN: 3319108190
Category : Technology & Engineering
Languages : en
Pages : 99
Get Book Here
Book Description
This book enables readers to design effective ESD protection solutions for all mainstream RF fabrication processes (GaAs pHEMT, SiGe HBT, CMOS). The new techniques introduced by the authors have much higher protection levels and much lower parasitic effects than those of existing ESD protection devices. The authors describe in detail the ESD phenomenon, as well as ESD protection fundamentals, standards, test equipment, and basic design strategies. Readers will benefit from realistic case studies of ESD protection for RFICs and will learn to increase significantly modern RFICs’ ESD safety level, while maximizing RF performance.
Author: Steven H. Voldman
Publisher: John Wiley & Sons
ISBN: 1119233135
Category : Technology & Engineering
Languages : en
Pages : 1172
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Book Description
A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Author: Steven H. Voldman
Publisher: John Wiley & Sons
ISBN: 0470061391
Category : Technology & Engineering
Languages : en
Pages : 420
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Book Description
With the growth of high-speed telecommunications and wireless technology, it is becoming increasingly important for engineers to understand radio frequency (RF) applications and their sensitivity to electrostatic discharge (ESD) phenomena. This enables the development of ESD design methods for RF technology, leading to increased protection against electrical overstress (EOS) and ESD. ESD: RF Technology and Circuits: Presents methods for co-synthesizisng ESD networks for RF applications to achieve improved performance and ESD protection of semiconductor chips; discusses RF ESD design methods of capacitance load transformation, matching network co-synthesis, capacitance shunts, inductive shunts, impedance isolation, load cancellation methods, distributed loads, emitter degeneration, buffering and ballasting; examines ESD protection and design of active and passive elements in RF complementary metal-oxide-semiconductor (CMOS), RF laterally-diffused metal oxide semiconductor (LDMOS), RF BiCMOS Silicon Germanium (SiGe), RF BiCMOS Silicon Germanium Carbon (SiGeC), and Gallim Arsenide technology; gives information on RF ESD testing methodologies, RF degradation effects, and failure mechanisms for devices, circuits and systems; highlights RF ESD mixed-signal design integration of digital, analog and RF circuitry; sets out examples of RF ESD design computer aided design methodologies; covers state-of-the-art RF ESD input circuits, as well as voltage-triggered to RC-triggered ESD power clamps networks in RF technologies, as well as off-chip protection concepts. Following the authors series of books on ESD, this book will be a thorough overview of ESD in RF technology for RF semiconductor chip and ESD engineers. Device and circuit engineers working in the RF domain, and quality, reliability and failure analysis engineers will also find it a valuable reference in the rapidly growing are of RF ESD design. In addition, it will appeal to graduate students in RF microwave technology and RF circuit design.
Author: Steven Voldman
Publisher: BoD – Books on Demand
ISBN: 1789848962
Category : Science
Languages : en
Pages : 104
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Book Description
As we enter the nanoelectronics era, electrostatic discharge (ESD) phenomena is an important issue for everything from micro-electronics to nanostructures. This book provides insight into the operation and design of micro-gaps and nanogenerators with chapters on low capacitance ESD design in advanced technologies, electrical breakdown in micro-gaps, nanogenerators from ESD, and theoretical prediction and optimization of triboelectric nanogenerators. The information contained herein will prove useful for for engineers and scientists that have an interest in ESD physics and design.
Author: Albert Wang
Publisher: John Wiley & Sons
ISBN: 1119850401
Category : Technology & Engineering
Languages : en
Pages : 436
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Book Description
An authoritative single-volume reference on the design and analysis of ESD protection for ICs Electrostatic discharge (ESD) is a major reliability challenge to semiconductors, integrated circuits (ICs), and microelectronic systems. On-chip ESD protection is a vital to any electronic products, such as smartphones, laptops, tablets, and other electronic devices. Practical ESD Protection Design provides comprehensive and systematic guidance on all major aspects of designs of on-chip ESD protection for integrated circuits (ICs). Written for students and practicing engineers alike, this one-stop resource covers essential theories, hands-on design skills, computer-aided design (CAD) methods, characterization and analysis techniques, and more on ESD protection designs. Detailed chapters examine an array of topics ranging from fundamental to advanced, including ESD phenomena, ESD failure analysis, ESD testing models, ESD protection devices and circuits, ESD design layout and technology effects, ESD design flows and co-design methods, ESD modelling and CAD techniques, and future ESD protection concepts. Based on the author’s decades of design, research and teaching experiences, Practical ESD Protection Design: • Features numerous real-world ESD protection design examples • Emphasizes on ESD protection design techniques and procedures • Describes ESD-IC co-design methodology for high-performance mixed-signal ICs and broadband radio-frequency (RF) ICs • Discusses CAD-based ESD protection design optimization and prediction using both Technology and Electrical Computer-Aided Design (TCAD/ECAD) simulation • Addresses new ESD CAD algorithms and tools for full-chip ESD physical design verification • Explores the disruptive future outlook of ESD protection Practical ESD Protection Design is a valuable reference for industrial engineers and academic researchers in the field, and an excellent textbook for electronic engineering courses in semiconductor microelectronics and integrated circuit designs.
Author: Albert Z.H. Wang
Publisher: Springer Science & Business Media
ISBN: 0306476185
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
This comprehensive and insightful book discusses ESD protection circuit design problems from an IC designer's perspective. On-Chip ESD Protection for Integrated Circuits: An IC Design Perspective provides both fundamental and advanced materials needed by a circuit designer for designing ESD protection circuits, including: Testing models and standards adopted by U.S. Department of Defense, EIA/JEDEC, ESD Association, Automotive Electronics Council, International Electrotechnical Commission, etc. ESD failure analysis, protection devices, and protection of sub-circuits Whole-chip ESD protection and ESD-to-circuit interactions Advanced low-parasitic compact ESD protection structures for RF and mixed-signal IC's Mixed-mode ESD simulation-design methodologies for design prediction ESD-to-circuit interactions, and more! Many real world ESD protection circuit design examples are provided. The book can be used as a reference book for working IC designers and as a textbook for students in the IC design field.
Author: Juin J. Liou
Publisher: CRC Press
ISBN: 1351830988
Category : Technology & Engineering
Languages : en
Pages : 378
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Book Description
Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry. Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection. Amply illustrated with tables, figures, and case studies, the text: Instills a deeper understanding of ESD events and ESD protection design principles Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.
Author: Jr., Edgar H. Callaway
Publisher: CRC Press
ISBN: 0203500709
Category : Computers
Languages : en
Pages : 360
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Book Description
Because they provide practical machine-to-machine communication at a very low cost, the popularity of wireless sensor networks is expected to skyrocket in the next few years, duplicating the recent explosion of wireless LANs. Wireless Sensor Networks: Architectures and Protocols describes how to build these networks, from the layers of the
Author: Mohammed Ismail
Publisher: Springer Science & Business Media
ISBN: 1402048246
Category : Technology & Engineering
Languages : en
Pages : 341
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Book Description
Radio Design in Nanometer Technologies is the first volume that looks at the integrated radio design problem as a "piece of a big puzzle", namely the entire chipset or single chip that builds an entire wireless system. This is the only way to successfully design radios to meet the stringent demands of today’s increasingly complex wireless systems.
Author: Shuqing Cao
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 137
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Book Description
It is the main objective of this work to address the scaling and design challenges of ESD protection in deeply scaled technologies. First, the thesis introduces the on-chip ESD events, the scaling and design challenges, and the nomenclatures necessary for later chapters. The ESD design window and the I/O schematics for both rail clamping and local clamping ESD schemes are illustrated. Then, the thesis delves into the investigation of the input and output driver devices and examines their robustness under ESD. The input driver's oxide breakdown levels are evaluated in deeply scaled technologies. The output driver's trigger and breakdown voltages are improved appreciably by applying circuit and device design techniques. The ESD device sections first discuss rail-based clamping, a widely used protection scheme. Two diode-based devices, namely the gated diode and substrate diode, are investigated in detail with SOI test structures. Characterization is based on DC current-voltage (I-V), Very Fast Transmission Line Pulse (VF-TLP), capacitance, and leakage measurements. Improvements in performance are realized. Technology computer aided design (TCAD) simulations help understand the physical effects and design tradeoffs. Then, the following section focuses on the local clamping scheme. Two devices, the field-effect diode (FED) and the double-well FED (DWFED), are developed and optimized in an SOI technology. Trigger circuits are designed to improve the turn-on speed. The advantages of local clamping is highlighted and compared with the rail-based clamping. The results show that the FED is a suitable option for power clamping applications and the DWFED is most suitable for pad-based local clamping. The thesis presents an ESD protection design methodology, which takes advantage of the results and techniques from pervious chapters and put each element into a useful format. Based on the correlation of package level and in-lab test results, a design process based on CDM target definition and device optimization, discharge path analysis, parasitic minimization, I/O data rate estimation and finally ESD and performance characterization is used sequentially to systematically realize the overall design goals.
