Natural and Mixed Convection in Electronic Equipment Cooling PDF Download
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Author: American Society of Mechanical Engineers. Winter Annual Meeting
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 88
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Book Description
Author: American Society of Mechanical Engineers. Winter Annual Meeting
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 88
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Book Description
Author: Sung Jin Kim
Publisher: CRC Press
ISBN: 1000151743
Category : Technology & Engineering
Languages : en
Pages : 264
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Book Description
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Author:
Publisher: Academic Press
ISBN: 0080575749
Category : Science
Languages : en
Pages : 411
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Book Description
Advances in Heat Transfer
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953
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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: Frank P. Incropera
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184
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Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: C.J. Hoogendoorn
Publisher: Springer Science & Business Media
ISBN: 9401110824
Category : Technology & Engineering
Languages : en
Pages : 334
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Book Description
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Author: Mathew V. K.
Publisher: CRC Press
ISBN: 1000590399
Category : Computers
Languages : en
Pages : 175
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Book Description
The continuous miniaturization of integrated circuit (IC) chips and the increase in the sleekness of the design of electronic components have led to the monumental rise of volumetric heat generation in electronic components. Hybrid Genetic Optimization for IC Chips Thermal Control: With MATLAB® Applications focuses on the detailed optimization strategy carried out to enhance the performance (temperature control) of the IC chips oriented at different positions on a switch-mode power supply (SMPS) board and cooled using air under various heat transfer modes. Seven asymmetric protruding IC chips mounted at different positions on an SMPS board are considered in the present study that is supplied with non-uniform heat fluxes. Key Features: Provides guidance on performance enhancement and reliability of IC chips Provides a detailed hybrid optimization strategy for the optimal arrangement of IC chips on a board The MATLAB program for the hybrid optimization strategy along with its stability analysis is carried out in a detailed manner Enables thermal design engineers to identify the positioning of IC chips on the board to increase their reliability and working cycle
Author: Guang-Jyh Hwang
Publisher: CRC Press
ISBN: 9780891168881
Category : Science
Languages : en
Pages : 822
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Book Description
A collection of research papers into transport phenomena in thermal control, closely related to several important aspects of cooling technology. Articles provide overviews of current advances and details of individual technologies including electronic and turbine cooling and Marangoni convection.
Author:
Publisher:
ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 1052
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Book Description
